Transfer Printing by Kinetic Control of Adhesion to an Elastomeric Stamp

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dc.contributor.authorMeitl, Mattew Ako
dc.contributor.authorZhu, Zheng-Taoko
dc.contributor.authorKumar, Vipanko
dc.contributor.authorLee, Keonjaeko
dc.contributor.authorFeng, Xueko
dc.contributor.authorHuang, Yonggang Yko
dc.contributor.authorAdesida, Ilesanmiko
dc.contributor.authorNuzzo, Ralph Gko
dc.contributor.authorRogers, John Ako
dc.date.accessioned2011-03-22T05:37:05Z-
dc.date.available2011-03-22T05:37:05Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2006-01-
dc.identifier.citationNATURE MATERIALS, v.5, no.1, pp.33 - 38-
dc.identifier.issn1476-1122-
dc.identifier.urihttp://hdl.handle.net/10203/22880-
dc.description.abstractAn increasing number of technologies require large-scale integration of disparate classes of separately fabricated objects into spatially organized, functional systems(1-9). Here we introduce an approach for heterogeneous integration based on kinetically controlled switching between adhesion and release of solid objects to and from an elastomeric stamp. We describe the physics of soft adhesion that govern this process and demonstrate the method by printing objects with a wide range of sizes and shapes, made of single-crystal silicon and GaN, mica, highly ordered pyrolytic graphite, silica and pollen, onto a variety of substrates without specially designed surface chemistries or separate adhesive layers. Printed p-n junctions and photodiodes fixed directly on highly curved surfaces illustrate some unique device-level capabilities of this approach.-
dc.description.sponsorshipThe authors thank A. Shim for helpful discussions, A. Jerez for help generating schematic cartoons, J. Rinne for supplying silica microspheres, J. Lyding for the use of his AFM, and C. J. Hubert for the use of her African Violets. This work was supported by DARPA-funded AFRL-managed Macroelectronics ProgramContract FA8650-04-C-7101, the US Department of Energy under grant DEFG02-91-ER45439, the National Science Foundation under grant DMII-0328162, and a graduate fellowship from the Fannie and John Hertz Foundation. Correspondence and requests for materials should be addressed to J.A.R.en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherNature Publishing Group-
dc.subjectTHIN-FILM TRANSISTORS-
dc.subjectSILICON-
dc.subjectINTEGRATION-
dc.subjectTECHNOLOGY-
dc.subjectMESOSCALE-
dc.subjectARRAYS-
dc.subjectFIELD-
dc.titleTransfer Printing by Kinetic Control of Adhesion to an Elastomeric Stamp-
dc.typeArticle-
dc.identifier.wosid000234379000012-
dc.identifier.scopusid2-s2.0-30044447991-
dc.type.rimsART-
dc.citation.volume5-
dc.citation.issue1-
dc.citation.beginningpage33-
dc.citation.endingpage38-
dc.citation.publicationnameNATURE MATERIALS-
dc.identifier.doi10.1038/nmat1532-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorLee, Keonjae-
dc.contributor.nonIdAuthorMeitl, Mattew A-
dc.contributor.nonIdAuthorZhu, Zheng-Tao-
dc.contributor.nonIdAuthorKumar, Vipan-
dc.contributor.nonIdAuthorFeng, Xue-
dc.contributor.nonIdAuthorHuang, Yonggang Y-
dc.contributor.nonIdAuthorAdesida, Ilesanmi-
dc.contributor.nonIdAuthorNuzzo, Ralph G-
dc.contributor.nonIdAuthorRogers, John A-
dc.type.journalArticleArticle-
dc.subject.keywordPlusTHIN-FILM TRANSISTORS-
dc.subject.keywordPlusSILICON-
dc.subject.keywordPlusINTEGRATION-
dc.subject.keywordPlusTECHNOLOGY-
dc.subject.keywordPlusMESOSCALE-
dc.subject.keywordPlusARRAYS-
dc.subject.keywordPlusFIELD-
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