Browse "EE-Patent(특허)" by Author Jin, Huxian

Showing results 1 to 10 of 10

1
Board-to-board interconnect apparatus including a microstrip circuit connected by a waveguide, where a bandwidth of a frequency band is adjustable

Bae, Hyeon-Min; Song, Ha Il; Jin, Huxian

2
Board-to-board interconnect apparatus including microstrip circuits connected by a waveguide, wherein a bandwidth of a frequency band is adjustable

Bae, Hyeon-Min; Song, Ha Il; Jin, Huxian

3
CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE

Bae, Hyeon-Min; Song, Ha Il; Jin, Huxian

4
INTERFACE ENTRE PUCES À PLUSIEURS CANAUX, À GRANDE VITESSE ET À FAIBLE PUISSANCE UTILISANT UN GUIDE D'ONDES DIÉLECTRIQUE

Bae, Hyeon-Min; Jin, Huxian

5
Low Power, High Speed Multi-Channel Chip-to-Chip Interface using Dielectric Waveguide

Bae, Hyeon-Min; Jin, Huxian, 2018-10-03

6
Low Power, High Speed Multi-Channel Chip-to-Chip Interface using Dielectric Waveguide

Bae, Hyeon-Min; Jin, Huxian

7
Low Power, High Speed Multi-Channel Chip-to-Chip Interface using Dielectric Waveguide

Bae, Hyeon-Min; Jin, Huxian

8
NIEDERLEISTUNGS- UND HOCHGESCHWINDIGKEITS-MEHRKANAL-CHIP-ZU-CHIP-SCHNITTSTELLE MIT EINEM DIELEKTRISCHEN WELLENLEITER

Bae, Hyeon-Min; Jin, Huxian

9
마이크로스트립 회로 및 유전체 웨이브가이드를 이용한 칩-대-칩 인터페이스

배현민; 송하일; Jin, Huxian

10
유전체 도파관을 이용한 멀티채널 Chip-to-Chip 저전력 고속 유선 인터페이스

Bae, Hyeon-Min; Ha Il, Song; Jin, Huxian, 2015-07-28

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