Effect of Material Properties of Double Layer Non-Conductive Films (D-NCFs) on the Reflow Reliability of Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro Bump Interconnection

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Publisher
IEEE-CPMT
Issue Date
2017-06-01
Language
English
Citation

2017 IEEE 67th Electronic Components and Technology Conference

URI
http://hdl.handle.net/10203/223718
Appears in Collection
MS-Conference Papers(학술회의논문)
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