Fabrication Process and Properties of SiCp/Al Metal Matrix Composites for Electronic Packaging Applications

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Publisher
Parallel Session on Composite Materials in Korean Institute of Metals and Materials
Issue Date
2000-10-27
Language
Korean
Citation

Parallel Session on Composite Materials in Korean Institute of Metals and Materials

URI
http://hdl.handle.net/10203/213474
Appears in Collection
MS-Conference Papers(학술회의논문)
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