Fabrication Process and Properties of SiCp/Al Metal Matrix Composites for Electronic Packaging Applications

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dc.contributor.authorLee, HS-
dc.contributor.authorHong, Soon Hyung-
dc.date.accessioned2016-11-09T02:13:29Z-
dc.date.available2016-11-09T02:13:29Z-
dc.date.created2016-08-29-
dc.date.issued2000-10-27-
dc.identifier.citationParallel Session on Composite Materials in Korean Institute of Metals and Materials-
dc.identifier.urihttp://hdl.handle.net/10203/213474-
dc.languageKorean-
dc.publisherParallel Session on Composite Materials in Korean Institute of Metals and Materials-
dc.titleFabrication Process and Properties of SiCp/Al Metal Matrix Composites for Electronic Packaging Applications-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameParallel Session on Composite Materials in Korean Institute of Metals and Materials-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocation한양대학교-
dc.contributor.localauthorHong, Soon Hyung-
dc.contributor.nonIdAuthorLee, HS-
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MS-Conference Papers(학술회의논문)
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