Fabrication Process and Properties of SiCp/Al Metal Matrix Composites for Electronic Packaging Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, HS | - |
| dc.contributor.author | Hong, Soon Hyung | - |
| dc.date.accessioned | 2016-11-09T02:13:29Z | - |
| dc.date.available | 2016-11-09T02:13:29Z | - |
| dc.date.created | 2016-08-29 | - |
| dc.date.issued | 2000-10-27 | - |
| dc.identifier.citation | Parallel Session on Composite Materials in Korean Institute of Metals and Materials | - |
| dc.identifier.uri | http://hdl.handle.net/10203/213474 | - |
| dc.language | Korean | - |
| dc.publisher | Parallel Session on Composite Materials in Korean Institute of Metals and Materials | - |
| dc.title | Fabrication Process and Properties of SiCp/Al Metal Matrix Composites for Electronic Packaging Applications | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | Parallel Session on Composite Materials in Korean Institute of Metals and Materials | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | 한양대학교 | - |
| dc.contributor.localauthor | Hong, Soon Hyung | - |
| dc.contributor.nonIdAuthor | Lee, HS | - |
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