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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Journal Papers(저널논문)

Thermally Stable Siloxane Hybrid Matrix with Low Dielectric Loss for Copper-Clad Laminates for High-Frequency Applications

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dc.contributor.authorKim, Yonghoko
dc.contributor.authorLim, Young Wooko
dc.contributor.authorKim, Yun Hyeokko
dc.contributor.authorBae, Byeong-Sooko
dc.date.accessioned2016-07-04T03:11:17Z-
dc.date.available2016-07-04T03:11:17Z-
dc.date.created2016-05-10-
dc.date.created2016-05-10-
dc.date.issued2016-04-
dc.identifier.citationACS APPLIED MATERIALS & INTERFACES, v.8, no.13, pp.8335 - 8340-
dc.identifier.issn1944-8244-
dc.identifier.urihttp://hdl.handle.net/10203/209019-
dc.description.abstractWe report vinyl-phenyl siloxane hybrid material (VPH) that can be used as a matrix for copper-clad laminates (CCLs) for high frequency applications. The CCLs, with a VPH matrix fabricated via radical polymerization of resin blend consisting of sol gel-derived linear vinyl oligosiloxane and bulky siloxane monomer, phenyltris(trimethylsiloxy)silane, achieve low dielectric constant (Dk) and dissipation factor (Df). The CCLs with the VPH matrix exhibit excellent dielectric performance (Dk = 2.75, Df = 0.0015 at 1 GHz) with stability in wide frequency range (1 MHz to 10 GHz) and at high temperature (up to 275 degrees C). Also, the VPH shows good flame resistance without any additives. These results suggest the potential of the VPH for use in highspeed IC boards-
dc.languageEnglish-
dc.publisherAMER CHEMICAL SOC-
dc.subjectDYNAMIC-MECHANICAL PROPERTIES-
dc.subjectEPOXY-
dc.subjectPERFORMANCE-
dc.subjectCOMPOSITES-
dc.subjectRETARDANCY-
dc.subjectETHER)-
dc.subjectRESINS-
dc.titleThermally Stable Siloxane Hybrid Matrix with Low Dielectric Loss for Copper-Clad Laminates for High-Frequency Applications-
dc.typeArticle-
dc.identifier.wosid000373748200003-
dc.identifier.scopusid2-s2.0-84964746593-
dc.type.rimsART-
dc.citation.volume8-
dc.citation.issue13-
dc.citation.beginningpage8335-
dc.citation.endingpage8340-
dc.citation.publicationnameACS APPLIED MATERIALS & INTERFACES-
dc.identifier.doi10.1021/acsami.6b01497-
dc.contributor.localauthorBae, Byeong-Soo-
dc.contributor.nonIdAuthorKim, Yun Hyeok-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorcopper clad laminates-
dc.subject.keywordAuthorlow dielectric loss-
dc.subject.keywordAuthorlow dielectric constant-
dc.subject.keywordAuthorsiloxane hybrid material-
dc.subject.keywordAuthorthermal stability-
dc.subject.keywordPlusDYNAMIC-MECHANICAL PROPERTIES-
dc.subject.keywordPlusEPOXY-
dc.subject.keywordPlusPERFORMANCE-
dc.subject.keywordPlusCOMPOSITES-
dc.subject.keywordPlusRETARDANCY-
dc.subject.keywordPlusETHER)-
dc.subject.keywordPlusRESINS-
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