학위논문(석사) - 한국과학기술원 : 신소재공학과, 2015.8 ,[v, 76 p. :]
Thin chip; Chip in Flex (CIF); Anisotropic Conductive Film; Conductive particle; Flexible package; Bending test; Fatigue test; Thermal compression bonding; 실리콘 칩; 플라즈마 분단; 이방성 전도 필름; 도전 볼; 플렉서블 패키징; 휨 특성
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.