A Non-contact Method to Measure Thermal Expansion Coefficient of PDMS for Soft Electronics

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Publisher
ISMP 2015
Issue Date
2015-10
Language
English
Citation

The 14th International Symposium on Microelectronics and Packaging

URI
http://hdl.handle.net/10203/204772
Appears in Collection
ME-Conference Papers(학술회의논문)
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