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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

A Non-contact Method to Measure Thermal Expansion Coefficient of PDMS for Soft Electronics

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dc.contributor.authorLee, Tae Ikko
dc.contributor.authorKim, Cheol Gyuko
dc.contributor.authorKim, MSko
dc.contributor.authorKim, Taek Sooko
dc.date.accessioned2016-04-18T05:50:41Z-
dc.date.available2016-04-18T05:50:41Z-
dc.date.created2015-12-15-
dc.date.issued2015-10-
dc.identifier.citationThe 14th International Symposium on Microelectronics and Packaging-
dc.identifier.urihttp://hdl.handle.net/10203/204772-
dc.languageEnglish-
dc.publisherISMP 2015-
dc.titleA Non-contact Method to Measure Thermal Expansion Coefficient of PDMS for Soft Electronics-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameThe 14th International Symposium on Microelectronics and Packaging-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationKINTEX Hall2, Ilsan-
dc.contributor.localauthorKim, Taek Soo-
dc.contributor.nonIdAuthorKim, MS-
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ME-Conference Papers(학술회의논문)
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