High-Yield Etching-Free Transfer of Graphene: Stress and Fracture Mechanical Approach

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Publisher
ISMP
Issue Date
2015-10-14
Language
English
Citation

The 14th International Symposium on Microelectronics and Packaging

URI
http://hdl.handle.net/10203/204769
Appears in Collection
ME-Conference Papers(학술회의논문)
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