High-Yield Etching-Free Transfer of Graphene: Stress and Fracture Mechanical Approach
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yoon, Tae Shik | ko |
| dc.contributor.author | Jo, Woo Sung | ko |
| dc.contributor.author | Kim, Tae Soo | ko |
| dc.date.accessioned | 2016-04-18T05:50:24Z | - |
| dc.date.available | 2016-04-18T05:50:24Z | - |
| dc.date.created | 2015-12-15 | - |
| dc.date.issued | 2015-10-14 | - |
| dc.identifier.citation | The 14th International Symposium on Microelectronics and Packaging | - |
| dc.identifier.uri | http://hdl.handle.net/10203/204769 | - |
| dc.language | English | - |
| dc.publisher | ISMP | - |
| dc.title | High-Yield Etching-Free Transfer of Graphene: Stress and Fracture Mechanical Approach | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 14th International Symposium on Microelectronics and Packaging | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | KINTEX Hall2, Ilsan | - |
| dc.contributor.localauthor | Kim, Tae Soo | - |
| dc.contributor.nonIdAuthor | Jo, Woo Sung | - |
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