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Design and Signal Integrity Analysis of High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module

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Lee, Hyun Suk / Cho, Kyung Jun / Kim, Hee Gon / Choi, Su Min / Lim, Jae Min / Shim, Hyun Woo / Kim, Joung Horesearcher
Publisher
24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Issue Date
2015-10-25
Language
English
Citation

24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

URI
http://hdl.handle.net/10203/204273
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EE-Conference Papers(학술회의논문)
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