Design and Signal Integrity Analysis of High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module

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dc.contributor.authorLee, Hyun Sukko
dc.contributor.authorCho, Kyung Junko
dc.contributor.authorKim, Hee Gonko
dc.contributor.authorChoi, Su Minko
dc.contributor.authorLim, Jae Minko
dc.contributor.authorShim, Hyun Wooko
dc.contributor.authorKim, Joung Hoko
dc.date.accessioned2016-04-18T04:54:10Z-
dc.date.available2016-04-18T04:54:10Z-
dc.date.created2015-11-24-
dc.date.issued2015-10-25-
dc.identifier.citation24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)-
dc.identifier.urihttp://hdl.handle.net/10203/204273-
dc.languageEnglish-
dc.publisher24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)-
dc.titleDesign and Signal Integrity Analysis of High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationDoubleTree by Hilton San Jose-
dc.contributor.localauthorKim, Joung Ho-
dc.contributor.nonIdAuthorCho, Kyung Jun-
dc.contributor.nonIdAuthorShim, Hyun Woo-
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EE-Conference Papers(학술회의논문)
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