Design and Signal Integrity Analysis of High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Hyun Suk | ko |
| dc.contributor.author | Cho, Kyung Jun | ko |
| dc.contributor.author | Kim, Hee Gon | ko |
| dc.contributor.author | Choi, Su Min | ko |
| dc.contributor.author | Lim, Jae Min | ko |
| dc.contributor.author | Shim, Hyun Woo | ko |
| dc.contributor.author | Kim, Joung Ho | ko |
| dc.date.accessioned | 2016-04-18T04:54:10Z | - |
| dc.date.available | 2016-04-18T04:54:10Z | - |
| dc.date.created | 2015-11-24 | - |
| dc.date.created | 2015-11-24 | - |
| dc.date.created | 2015-11-24 | - |
| dc.date.issued | 2015-10-25 | - |
| dc.identifier.citation | 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/204273 | - |
| dc.language | English | - |
| dc.publisher | 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) | - |
| dc.title | Design and Signal Integrity Analysis of High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000377890500033 | - |
| dc.identifier.scopusid | 2-s2.0-84962816200 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | DoubleTree by Hilton San Jose | - |
| dc.contributor.localauthor | Kim, Joung Ho | - |
| dc.contributor.nonIdAuthor | Cho, Kyung Jun | - |
| dc.contributor.nonIdAuthor | Shim, Hyun Woo | - |
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