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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Improved Copper chemical vapor deposition process by applying substrate bias Lee, Won-Jun; Chun , Soung Soon; Rha, Sa-Kyun; Lee, Seung-Yun; Kim, Dong-Won; Park, Chong-Ook, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.427, pp.207 - 212, 1996 |
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