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A New Lateral Field Emission Device Using Chemical-Mechanical Polishing c.-s. lee; j.-d. lee; Han, Chul-Hi, IEEE ELECTRON DEVICE LETTERS, v.21, no.10, pp.479 - 481, 2000-10 |
A novel sub-micron gap fabrication technology using chemical-mechanical polishing (CMP): application to lateral field emission device (FED) Lee C.-S.; Han C.-H., SENSORS AND ACTUATORS A-PHYSICAL, v.1997-08-01, pp.739 - 743, 2002 |
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