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Browse "School of Mechanical and Aerospace Engineering(기계항공공학부)" by Subject mechanical reliability

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Showing results 1 to 7 of 7

1
(A) study on the mechanical reliability of solder joints in electronic packaging = 전자 패키지 소더 조인트의 기계적 신뢰성에 관한 연구link

Ham, Suk-Jin; 함석진; et al, 한국과학기술원, 2002

2
Controlling Neutral Plane of Flexible Substrates by Asymmetric Impregnation of Glass Fabric for Protecting Brittle Films on Foldable Electronics

Jo, Woosung; Lee, Hyunhwan; Lee, Yung; Bae, Byeong-Soo; Kim, Taek-Soo, ADVANCED ENGINEERING MATERIALS, v.23, no.6, pp.2001280, 2021-06

3
Direct Visualization of Cross-Sectional Strain Distribution in Flexible Devices

Lee, Tae-Ik; Jo, Woosung; Kim, Wansun; Kim, Ji-Hye; Paik, Kyung-Wook; Kim, Taek-Soo, ACS APPLIED MATERIALS & INTERFACES, v.11, no.14, pp.13416 - 13422, 2019-04

4
Integration of graphene electrode on cylindrical substrates by thin film rolling method = 회전식 박막 코팅법을 이용한 원통형 기판용 그래핀 전극 적용link

Kang, Sumin; Kim, Taek-Soo; et al, 한국과학기술원, 2017

5
Quantum Dot-Siloxane Anchoring on Colloidal Quantum Dot Film for Flexible Photovoltaic Cell

Kim, Changjo; Kozakci, Irem; Lee, Sang Yeon; Kim, Byeongsu; Kim, Junho; Lee, Jihyung; Ma, Boo Soo; et al, SMALL, v.19, no.41, 2023-10

6
Simultaneous monitoring of strain and temperature embedded into composites using strength enhanced FBG sensors = 강도가 향상된 FBG 센서를 이용한 복합재 구조물의 온도와 변형률 동시 모니터링에 관한 연구link

Yoon, Hyuk-Jin; 윤혁진; et al, 한국과학기술원, 2006

7
다층 칩 패키지의 변형 및 균열 해석 = Analysis of deformations and cracks in multi-chip packageslink

박정순; Park, Jeong-Soon; et al, 한국과학기술원, 2006

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