학위논문(석사) - 한국과학기술원 : 기계공학전공, 2006.2, [ viii, 86 p. ]
몰딩공정; 기계적 신뢰성; 다층 칩 패키지; 계면 균열; interfacial crack; molding process; mechanical reliability; Multi-chip packages
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.