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Browse "School of Mechanical and Aerospace Engineering(기계항공공학부)" by Author Yoo C.D.

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Showing results 1 to 4 of 4

1
Development of inclined conductive bump (ICB) for flip-chip interconnection

Park A.-Y.; Kim S.-R.; Yoo C.D.; Kim, Taek-Soo, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.880 - 885, ECTC, 2011-05-31

2
Laser weld keyhole dynamics

Cho M.H.; Farson D.; Zoofan B.; Lee J.Y.; Yoo C.D., Trends in Welding Research: Proceedings of the 6th International Conference, pp.112 - 117, 2002-04-15

3
Low temperature hybrid bonding using self-alignment

Lee J.H.; Ha T.H.; Lee C.W.; Song J.-Y.; Yoo C.D., 3rd Electronics System Integration Technology Conference, ESTC 2010, 2010-09-13

4
Pre-bonding method using self-alignment effect for multichip packaging

Lee J.H.; Ha T.H.; Lee C.W.; Song J.-Y.; Cha M.S.; Yoo C.D., 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, pp.118 - 123, 2009-11-17

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