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Showing results 1 to 5 of 5

1
An efficient edge traces technique for 3D interconnection of stack chip

Kim, SR; Park, AY; Yoo, CD; Lee, JH; Song, JY; Lee, Seung Seob, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1878 - 1882, 2011-05-31

2
COP: a new corner detector

Bae, SC; Kweon, In-So; Yoo, CD, PATTERN RECOGNITION LETTERS, v.23, no.11, pp.1349 - 1360, 2002-09

3
Emotional Exchange of a Socially Interactive Robot

Kwon, Dong-Soo; Chung, Myung Jin; Park, JC.; Yoo, CD; Jee, ES; Park, KS; Kim,YM; et al, IFAC World Congress 2008, pp.4330 - 4335, IFAC, 2008-07-06

4
Influence of pad shape on self-alignment in electronic packaging

Ahn, DH; Lee, J; Yoo, CD; Kim, YS, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.411 - 415, 2006-03

5
Thermosonic bonding of crossed strip Au bumps

Kim, JH; Kim, BC; Lee, J; Yoo, CD, SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, v.10, no.5, pp.604 - 609, 2005

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