Browse "School of Electrical Engineering(전기및전자공학부)" by Type Article

Showing results 10561 to 10620 of 12558

10561
Thermoelectric properties of screen-printed ZnSb film

Lee, Heon Bok; We, Ju Hyung; Yang, Hyun Jeong; Kim, Kukjoo; Choi, Kyung Cheolresearcher; Cho, Byung Jinresearcher, THIN SOLID FILMS, v.519, no.16, pp.5441 - 5443, 2011-06

10562
Thermofluorescent Conjugated Polymer Sensors for Nano- and Microscale Temperature Monitoring

Yarimaga, Oktay; Lee, Su-Mi; Ham, Dae-Young; Choi, Ji-Min; Kwon, Soon-Gyu; Im, Mae-Soon; Kim, Sung-Ho; et al, MACROMOLECULAR CHEMISTRY AND PHYSICS, v.212, no.12, pp.1211 - 1220, 2011-06

10563
Thermooptic 2x2 asymmetric digital opticat switches with zero-voltage operation state

Noh, YO; Kim, JM; Yang, MS; Choi, HJ; Lee, HJ; Won, YHresearcher; Han, SG, IEEE PHOTONICS TECHNOLOGY LETTERS, v.16, no.2, pp.446 - 448, 2004-02

10564
Thick-Copper-Buried Inductors Using Anodized Aluminum Package Substrates

Kim, Cheol Ho; Kwon, Young-Seresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.8, pp.1260 - 1264, 2012-08

10565
Thickness dependent low-frequency noise characteristics of a-InZnO thin-film transistors under light illumination

Choi, Hyun-Sik; Jeon, Sanghunresearcher, APPLIED PHYSICS LETTERS, v.104, no.2, 2014-01

10566
THICKNESS UNIFORMITY AND ELECTRICAL-PROPERTIES OF ULTRATHIN GATE OXIDES GROWN IN N2O AMBIENT BY RAPID THERMAL-PROCESSING

Yoon, Giwanresearcher; JOSHI, AB; AHN, J; KWONG, DL, JOURNAL OF APPLIED PHYSICS, v.72, no.12, pp.5706 - 5710, 1992-12

10567
Thin Film Bulk Acoustic Resonators for RF Applications

Linh Mai; Jae-Young Lee; 윤기완researcher, 국제해양정보통신학회영문논문지, v.4, no.3, pp.111 - 113, 2006-09

10568
Thin film encapsulation for organic light emitting diodes using a multi-barrier composed of MgO prepared by atomic layer deposition and hybrid materials

Kim, Eungtaek; Han, Yuncheol; Kim, Woohyun; Choi, Kyung Cheolresearcher; Im, Hyeon-Gyun; Bae, Byeong-Sooresearcher, ORGANIC ELECTRONICS, v.14, no.7, pp.1737 - 1743, 2013-07

10569
Thin film solar cells on honeycomb-structured substrates for photovoltaic building blocks

Baik, Seung Jae; Lee, Yong-Min; Lim, Koeng Suresearcher; Kim, Keun-Taek, RENEWABLE ENERGY, v.64, pp.98 - 104, 2014-04

10570
Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems

Cho, Yeonje; Lee, Seongsoo; Kim, Dong-Hyun; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; Park, Junyong; et al, IEEE Transactions on Electromagnetic Compatibility, v.60, no.4, pp.1001 - 1009, 2018-08

10571
Thin Ion-Gel Dielectric Layer to Enhance the Stability of Polymer Transistors

Lee, Sung Won; Shin, Minkwan; Park, Jae Yoon; Kim, Bong Soo; Tu, Deyu; Jeon, Sanghunresearcher; Jeong, Unyong, SCIENCE OF ADVANCED MATERIALS, v.7, no.5, pp.874 - 880, 2015-05

10572
Thin Metallic Heat Sink for Interfacial Thermal Management in Biointegrated Optoelectronic Devices

Jung H.H.; Song J.; Nie S.; Jung H.N.; Kim M.S.; Jeong, Jae-Woongresearcher; Song Y.M.; et al, Advanced Materials Technologies, v.3, no.11, 2018-11

10573
Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems

, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02

10574
Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems

Cho, Yeonje; Kim, Jonghoon; Kim, DongHyun; Lee, Seongsoo; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02

10575
Thin-Film Thermoelectric Module for Power Generator Applications Using a Screen-Printing Method

Lee, Heon-Bok; Yang, Hyun Jeong; We, Ju Hyung; Kim, Kukjoo; Choi, Kyung Cheolresearcher; Cho, Byung Jinresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.40, no.5, pp.615 - 619, 2011-05

10576
Thin-film transistor-driven vertically stacked full-color organic light-emitting diodes for high-resolution active-matrix displays

Choi, Sukyung; Kang, Chan-mo; Byun, Chun-Won; Cho, Hyunsu; Kwon, Byoung-Hwa; Han, Jun-Han; Yang, Jong-Heon; et al, NATURE COMMUNICATIONS, v.11, no.1, 2020-06

10577
Three Phase Resonant Pole Inverter Using a New Sepa Sated Soft Switching Resonant Pole

J.G.Cho; D.Y.Hu; G.H.Choresearcher, 전기학회논문지, v.4, no.2, pp.90 - 97, 1991

10578
Three phase three-level PWM switched voltage source inverter with zero neutral point potential

Oh, Won-Sik; Han, Sang-Kyoo; Choi, Seong-Wook; Moon, GunWooresearcher, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.21, no.5, pp.1320 - 1326, 2006-09

10579
Three-Dimensional Blood Vessel Quantification via Centerline Deformation

Kang, Dong-Goo; Suh, Dae Chul; Ra, Jong Beomresearcher, IEEE TRANSACTIONS ON MEDICAL IMAGING, v.28, pp.405 - 414, 2009-03

10580
Three-dimensional electro-floating display system using an integral imaging method

Min, SW; Hahn, Minsooresearcher; Kim, J; Lee, B, OPTICS EXPRESS, v.13, pp.4358 - 4369, 2005-06

10581
Three-Dimensional Fin-Structured Semiconducting Carbon Nanotube Network Transistor

Lee, Dong-Il; Lee, Byung-Hyun; Yoon, Jinsu; Ahn, Dae-Chul; Park, Jun-Young; Hur, Jae; Kim, Myung-Su; et al, ACS NANO, v.10, no.12, pp.10894 - 10900, 2016-12

10582
Three-Dimensional Integration Approach to High-Density Memory Devices

Kim, Hojung; Jeon, Sanghunresearcher; Lee, Myoung-Jae; Park, Jaechul; Kang, Sangbeom; Choi, Hyun-Sik; Park, Churoo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.58, no.11, pp.3820 - 3828, 2011-11

10583
Three-dimensional interconnect for multilayer module packages with selectively anodised aluminium substrate

Yeo, S. K.; Kwon, Young Seresearcher, ELECTRONICS LETTERS, v.45, no.13, pp.678 - 680, 2009-06

10584
Three-dimensional nanopillar-array photovoltaics on low-cost and flexible substrates

Fan, Zhiyong; Razavi, Haleh; Do, Jae-won; Moriwaki, Aimee; Ergen, Onur; Chueh, Yu-Lun; Leu, Paul W.; et al, NATURE MATERIALS, v.8, no.8, pp.648 - 653, 2009-08

10585
Three-dimensional quantum simulation of multigate nanowire field effect transistors

Shin, Mincheolresearcher, MATHEMATICS AND COMPUTERS IN SIMULATION, v.79, no.4, pp.1060 - 1070, 2008-12

10586
Three-dimensional solar steam generation device with additional non-photothermal evaporation

Kim, Kwanghyun; Yu, Sunyoung; Kang, Se-Young; Ryu, Seung-Takresearcher; Jang, Ji-Hyun, DESALINATION, v.469, 2019-11

10587
Three-dimensionally patterned Ag-Pt alloy catalyst on planar Si photocathodes for photoelectrochemical H-2 evolution

Lim, Sung Yul; Ha, Kyungyeon; Ha, Heonhak; Lee, Soo Youn; Jang, Min Seokresearcher; Choi, Mansoo; Chung, Taek Dong, PHYSICAL CHEMISTRY CHEMICAL PHYSICS, v.21, no.8, pp.4184 - 4192, 2019-01

10588
Three-Electrode Metal-Oxide Gas Sensor System With CMOS Interface IC

Park, Jeong Ho; Park, Kwang Min; Kim, Tae-Wan; Shin, Seongheon; Park, Chong-Ookresearcher; Yoo, Hyung-Jounresearcher, IEEE SENSORS JOURNAL, v.17, no.3, pp.784 - 793, 2017-02

10589
Three-Level Capacitor Clamping Single Sustaining Driver With Dual Energy Recovery Path for Low Cost AC Plasma Display Panel

Choi, SW; Moon, GunWooresearcher, JOURNAL OF DISPLAY TECHNOLOGY, v.5, pp.398 - 407, 2009-10

10590
Three-level differential buffer for increasing noise margin in pseudo-differential signalling

Ha, K. -S.; Kim, Lee-Supresearcher; Bae, S. -J.; Park, K. -I.; Choi, J. S.; Jun, Y. -H., ELECTRONICS LETTERS, v.46, no.21, pp.1429 - 1430, 2010-10

10591
Three-Level Resonant Converter With Double Resonant Tanks for High-Input-Voltage Applications

Lee, Il-Oun; Cho, Shin-young; Moon, Gun-Wooresearcher, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.59, no.9, pp.3450 - 3463, 2012-09

10592
Three-stage clos-network switch architecture with buffered center stage for multi-class traffic

Kang, MK; Kyung, Chong-Minresearcher, JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS, v.15, pp.263 - 276, 2006-04

10593
Three-stage model for robust real-time face tracking

Do, Jun-Hyeong; Bien, Zeung namresearcher, INTERNATIONAL JOURNAL OF IMAGING SYSTEMS AND TECHNOLOGY, v.17, no.6, pp.321 - 327, 2007

10594
Three-STEP HEURISTIC ALGORITHM FOR OPTIMAL PLA COLUMN FOLDING

YANG, YY; Kyung, Chong-Minresearcher, ELECTRONICS LETTERS, v.24, no.17, pp.1088 - 1090, 1988-08

10595
Three-STEP PIN ASSIGNMENT ALGORITHM FOR BUILDING BLOCK LAYOUT

CHOI, SG; Kyung, Chong-Minresearcher, ELECTRONICS LETTERS, v.28, no.20, pp.1882 - 1884, 1992-09

10596
Three-Switch Active-Clamp Forward Converter With Low Switch Voltage Stress and Wide ZVS Range for High-Input-Voltage Applications

Park, Ki-Bumresearcher; Kim, Chong-Eun; Moon, GunWooresearcher; Youn, Myung Joongresearcher, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.25, pp.889 - 898, 2010-04

10597
Three-transistor one-time programmable (OTP) ROM cell array using standard CMOS gate oxide antifuse

Kim, J; Lee, Kwyroresearcher, IEEE ELECTRON DEVICE LETTERS, v.24, pp.589 - 591, 2003-09

10598
THRESHOLD BOOLEAN FILTERS

LEE, KD; Lee, Yong-Hoonresearcher, IEEE TRANSACTIONS ON SIGNAL PROCESSING, v.42, no.8, pp.2022 - 2036, 1994-08

10599
THRESHOLD SELECTION ALGORITHM FOR EXTRACTING A UNIFORM COLOR REGION IN AN IMAGE

CHANG, BH; Kim, Seong-Daeresearcher; Kim, Jae Kyoon, ELECTRONICS LETTERS, v.23, no.25, pp.1362 - 1363, 1987-12

10600
Threshold Voltage Tuning Technique in Gate-All-Around MOSFETs by Utilizing Gate Electrode With Potential Distribution

Park, Jun-Young; Bae, Hagyoul; Moon, Dong-Il; Jeon, Chang-Hoon; Choi, Yang-Kyuresearcher, IEEE ELECTRON DEVICE LETTERS, v.37, no.11, pp.1391 - 1394, 2016-11

10601
Threshold-based camera motion characterization of MPEG video

Kim, JG; Chang, HS; Kim, J; Kim, Hyung-Myungresearcher, ETRI JOURNAL, v.26, pp.269 - 272, 2004-06

10602
Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01

10603
Through-Silicon Via (TSV) Capacitance-Voltage (CV) Hysteresis Modeling for 2.5D and 3D IC

Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jounghyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE Transactions on Components, Packaging and Manufacturing Technology, v.7, no.6, pp.925 - 935, 2017-06

10604
Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC

Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06

10605
Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Horesearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09

10606
Throughput Analysis Considering Coupling Effect in IEEE 802.11 Networks with Hidden Stations

Kim, Tae-Joon; Lim, Jong-Taeresearcher, IEEE COMMUNICATIONS LETTERS, v.13, pp.175 - 177, 2009-03

10607
THROUGHPUT ANALYSIS FOR 2 ARQ SCHEMES USING COMBINED TRANSITION MATRIX

KIM, SR; Un, Chong-Kwanresearcher, IEEE TRANSACTIONS ON COMMUNICATIONS, v.40, no.11, pp.1679 - 1683, 1992-11

10608
THROUGHPUT ANALYSIS OF CHANNEL LOAD SENSE MULTIPLE ACCESS WITH OVERLOAD DETECTION PROTOCOL IN SPREAD SPECTRUM PACKET RADIO NETWORKS

LIM, DM; Lee, Hwang Sooresearcher, ELECTRONICS LETTERS, v.27, no.20, pp.1809 - 1810, 1991-09

10609
Throughput analysis of IEEE 802.11e wireless LANs and efficient Block Ack mechanism

Lee, IG; Yoo, Hyung Jounresearcher; Park, Sin Chongresearcher, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E88B, no.1, pp.402 - 407, 2005-01

10610
Throughput and Delay Performance of DSL Broadband Access with Cross-Layer Dynamic Spectrum Management

Tsiaflakis, Paschalis; Yi, Yungresearcher; Chiang, Mung; Moonen, Marc, IEEE TRANSACTIONS ON COMMUNICATIONS, v.60, no.9, pp.2700 - 2711, 2012-09

10611
Throughput Characteristics by Multiuser Diversity in a Cognitive Radio System

Hong, Jun-Pyo; Choi, Wanresearcher, IEEE TRANSACTIONS ON SIGNAL PROCESSING, v.59, no.8, pp.3749 - 3763, 2011-08

10612
Throughput Efficiency of LAPB/D Protocol with Multi-Reject Error Recovery Procedure

W.Y.Jung; C.K.Unresearcher, ELECTRONICS LETTERS, v.25, no.19, pp.1318 - 1320, 1989-09

10613
Throughput enhancement scheme in an OFCDM system over slowly-varying frequency-selective channels

Chang, K; Han, Youngnamresearcher, INFORMATION NETWORKING: CONVERGENCE IN BROADBAND AND MOBILE NETWORKING BOOK SERIES: LECTURE NOTES IN COMPUTER SCIENCE, v.3391, pp.697 - 706, 2005

10614
Throughput Estimation of Downlink Packet Access Systems Based on a Point Mass Approximation Concept

Kim, Junsu; Moon, Sung Ho; Sung, Dan Keunresearcher, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, v.59, no.7, pp.3356 - 3363, 2010-09

10615
Throughput Improvement in Wireless Multi-Hop Ad-Hoc Networks Using Load Control

Oh, Jun-Han; Lim, Jong-Taeresearcher, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E92B, pp.314 - 317, 2009-01

10616
THROUGHPUT-DELAY AND STABILITY ANALYSIS OF AN ASYNCHRONOUS SPREAD SPECTRUM PACKET RADIO NETWORK

LIM, DM; Lee, Hwang Sooresearcher, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, v.41, no.4, pp.469 - 478, 1992-11

10617
THz Detector with an Antenna Coupled Stacked CMOS Plasma-Wave FET

Chai, Seung Wan; Lim, Sungmook; Hong, Song-Cheolresearcher, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.24, no.12, pp.869 - 871, 2014-12

10618
Ti thickness effects in Pt/Ti bottom electrode on properties of (Ba,Sr)TiO3 thin film

Cha, SY; Lee, SH; Lee, Hee Chulresearcher, INTEGRATED FERROELECTRICS, v.16, no.1-4, pp.183 - 190, 1997

10619
TID Effect Test of the ICS307GI-03LF Serially Programmable Clock Source for Space Applications

Shin, Goo-Hwanresearcher; Ryu, Kwang-Sun; Myung, Noh-Hoonresearcher; Kim, Ee-Eul, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.59, pp.670 - 673, 2011-08

10620
Tilted-Beam Switched Array Antenna for UAV Mounted Radar Applications with 360 degrees Coverage

Lee, Cheol Ung; Noh, Gunhark; Ahn, ByungKuon; Yu, Jong-Wonresearcher; Lee, Han Lim, ELECTRONICS, v.8, no.11, 2019-11

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