Browse "School of Electrical Engineering(전기및전자공학부)" by Title 

Showing results 8901 to 8920 of 51620

8901
Analysis of the radiation from multiple slots on a conducting circular cylinder using the fourier transform and mode matching method = 푸리에 변환과 모드 정합법을 이용한 도체 원형 실린더상의 다중 슬롯에서의 복사 해석link

Shin, Dong-Hoon; 신동훈; et al, 한국과학기술원, 2005

8902
Analysis of the small band-rejected antenna with the parasitic strip for UWB

Kim, KH; Park, SeongOok, IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, v.54, pp.1688 - 1692, 2006-06

8903
Analysis of the Vertical Electromagnetic Bandgap Structures in the Power Distribution Network for the Multi-layer Printed Circuit Board

Yoo, Jeongsik; Park, Hyunjeong; Park, Jongbae; Kim, Junchul; Shim, Yujeong; Kim, Joungho, IEEE Electronics Packaging Technology Conference, EPTC, pp.1381 - 1386, IEEE, 2009-01-27

8904
Analysis of thermal effects on crosstalk and performance of optoelectronic transmitter modules

Ukaegbu, Ikechi Augustine; Sangirov, Jamshid; Lee, Tae Woo; Cho, Mu Hee; Park, HyoHoon, OptoElectronics and Communications Conference, Optical Society of Korea, 2012-07-05

8905
Analysis of thin copper Schottky barrier photodetector operable in the near-infrared region = 근적외선 영역에서 동작할 수 있는 구리 박막 쇼트키 장벽 광 검출기의 분석link

Seok, Jongeun; Yu, Kyoungsik; et al, 한국과학기술원, 2023

8906
Analysis of threshold decomposition and continuity for median-type filters and its application to nonlinear filter design = 미디언형 필터의 임계분해 및 연속성에 관한 해석과 비선형 필터 설계에 대한 이의 응용link

Jeong, Byung-Jang; 정병장; et al, 한국과학기술원, 1997

8907
Analysis of through glass via (TGV) noise coupling effect to noise figure of 2.4GHz LNA on glass interposer

Hwang, Insu; Kim, Jihye; Kim, Youngwoo; Cho, Jong-Hyun; Kim, Joungho; Sundaram, Venky; Tummala, Rao, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.85 - 88, Institute of Electrical and Electronics Engineers Inc., 2015-12

8908
Analysis of Throughput and Delay of a High-speed Slotted Ring Based on Lumped Modeling

W.Y.Jung; C.K.Un, IEEE TRANSACTIONS ON COMMUNICATIONS, v.40, no.5, pp.860 - 862, 1992-05

8909
Analysis of throughput and efficient block size based polling scheme for IEEE 802.11e Wireless LANs

Lee I.-G.; Yoon S.-R.; Park, Sin Chong, 2005 IEEE International Conference on Communications, ICC 2005, v.5, pp.3467 - 3473, 2005-05-16

8910
Analysis of throughput and energy consumption in a ZigBee network under the presence of bluetooth interference

Chong, J.W.; Hwang, H.Y.; Jung, C.Y.; Sung, Dan Keun, 50th Annual IEEE Global Telecommunications Conference, GLOBECOM 2007, pp.4749 - 4753, 2007-11-26

8911
Analysis of throughput in a ZigBee network under the presence of WLAN interference

Chong, J.W.; Hwang, H.Y.; Jung, C.Y.; Sung, Dan Keun, ISCIT 2007 - 2007 International Symposium on Communications and Information Technologies, pp.1166 - 1170, 2007-10-16

8912
ANALYSIS OF TM SCATTERING FROM FINITE RECTANGULAR GROOVES IN A CONDUCTING PLANE

PARK, TJ; Eom, Hyo Joon; YOSHITOMI, K, JOURNAL OF THE OPTICAL SOCIETY OF AMERICA A-OPTICS IMAGE SCIENCE AND VISION, v.10, no.5, pp.905 - 911, 1993-05

8913
Analysis of Transconductance (g(m)) in Schottky-Barrier MOSFETs

Choi, Sung-Jin; Choi, Chel-Jong; Kim, Jee-Yeon; Jang, Moon-Gyu; Choi, Yang-Kyu, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.58, no.2, pp.427 - 432, 2011-02

8914
Analysis of Transmission Line Discontinuities by 3-Dimensional Finite-Element Method

Lee, S.S.; Ahn, C.H.; Jeong, B.S; Lee, Soo-Young; Ra, J.W., IEEE MTT Korea Chapter Seminar, 1990-11

8915
Analysis of transmission through slit and multiple grooves structures for biosensors

Kim, Bong Ho; Nakarmi, Bikash; Won, Yong Hyub, SPIE Photonics West 2015, SPIE, 2015-02-08

8916
Analysis of Transmission-Line Discontinuities by 3-Dimensional Finite Element Method

S.S.Lee; C.H.Ahn; B.S.Jeong; S.Y.Lee, 전자공학회논문지, v.28, no.5, pp.355 - 359, 1991

8917
Analysis of Trapped Charges in Dopant-Segregated Schottky Barrier-Embedded FinFET SONOS Devices

Choi, Sung-Jin; Han, Jin-Woo; Jang, Moon-Gyu; Choi, Yang-Kyu, IEEE ELECTRON DEVICE LETTERS, v.30, no.10, pp.1084 - 1086, 2009-10

8918
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs

Song, T; Liu, C; Kim, DH; Lim, SK; Cho, J; Kim, J; Pak, JS; et al, 12th International Symposium on Quality Electronic Design, ISQED 2011, pp.122 - 128, ISQED 2011, 2011-03-14

8919
Analysis of ultimate capacity and transparency cost of all-optical transport networks based on node throughput

Kim, HD; Lee, Chang-Hee, Proceedings of the 1999 Pacific Rim Conference on Lasers and Electro-Optcis (CLEO/PACIFIC Rim '99), v.4, pp.1285 - 1286, 1999-08-30

8920
Analysis of Ultra Stable Tracking Oscillator with Wide Frequency Control Range

Na, JR; Park, KC; Bien, Zeung nam, JOURNAL OF THE KTA, v.4, pp.135 - 140, 1991-01

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