Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs

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Publisher
ISQED 2011
Issue Date
2011-03-14
Language
ENG
Citation

12th International Symposium on Quality Electronic Design, ISQED 2011, pp.122 - 128

URI
http://hdl.handle.net/10203/164869
Appears in Collection
EE-Conference Papers(학술회의논문)
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