Showing results 1 to 2 of 2
40-Gb/s package design using wire-bonded plastic ball grid array Kam, Dona Gun; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.31, no.2, pp.258 - 266, 2008-05 |
Design of high-performance and low-cost channel in high-speed serial link = 고속 직렬 링크 내 저가형 고성능 채널 설계link Kam, Dong-Gun; 감동근; et al, 한국과학기술원, 2006 |
Discover