Browse "School of Electrical Engineering(전기및전자공학부)" by Author Park, Kunwoo
Showing results 1 to 13 of 13
| A 6.4Gbps On-chip Eye Opening Monitor Circuit for Signal Integrity Analysis of High Speed Channel Kim, Joungho; Shin, Mincheol; Shim, Jongjoo; Kim, Jaemin; Pak, Jun So; Hwang, Chulsoon; Yoon, Changwook; et al, Presented at Proceeding of 2008 IEEE EMC Symposium, pp.1 - 7, 2008-08 |
| A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Joo-Hee; Choi, Sumin; Kim, Ki-Yeong; Lee, Junho; Park, Kunwoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.28 - 39, 2015-01 |
| An 81.2dB-SNDR Dual-Residue Pipeline ADC with a 2nd-Order Noise-Shaping Interpolating SAR ADC Chung, Jaehyun; Kim, Ye Dam; Park, Chang Un; Park, Kunwoo; Seo, Min-Jae; Ryu, Seung-Tak, 44th Annual IEEE Custom Integrated Circuits Conference, CICC 2023, IEEE, 2023-04-25 |
| Bump-less High Speed Channel on Silicon, Organic and Glass Interposer Kim, Joung-Ho; Lee, Hyunsuk; Kim, Heegon; Kim, Kiyeong; Jung, Daniel H.; Kim, Jonghoon J.; Choi, Sumin; et al, 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SIPI), 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SIPI), 2014-08-05 |
| Crosstalk Reduction Passive Equalizer using MIM Capacitor between Differential Signaling Pairs on High-speed Interposer Kim, Joungho; Choi, Sumin; Kim, Heegon; Kim, Sukjin; Kim, Kiyeong; Lee, Junho; Park, Kunwoo, 2013 Asia Pacific – Radio Science Conference, 2013 Asia Pacific – Radio Science Conference, 2013-09-06 |
| Design and Measurement of a Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Differential Signaling Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Jung, Daniel H; Kim, Jonghoon J; Choi, Sumin; Lee, Junho; et al, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.5 - 9, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
| Design of Contactless Wafer-level TSV Connectivity Testing Structure using Capacitive Coupling Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Kim, Sukjin; Bae, Bumhee; Jung, Daniel H; Kong, Sunkyu; et al, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.158 - 162, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
| Design of Crosstalk Compensation Passive Equalizers for High-speed Differential Signaling on 2.5D-IC Interposer Kim, Joungho; Choi, Sumin; Kim, Heegon; Kim, Sukjin; Jung, Daniel H; Lee, Junho; Park, Kunwoo, 2013 IEEE Electrical Design of Advanced Package & Systems Symposium , pp.253 - 256, 2013 IEEE Electrical Design of Advanced Package & Systems Symposium, 2013-12-13 |
| Electrical characterization of bump-less high speed channel on silicon, organic and glass interposer Lee, Hyunsuk; Kim, Hee-Gon; Kim, Kiyeong; Jung, Daniel Hyunsuk; Kim, Jonghoon J; Choi, Sumin; Lim, Jaemin; et al, 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014, pp.850 - 854, Institute of Electrical and Electronics Engineers Inc., 2014-08 |
| High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul; Lee, Junho; Park, Kunwoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.4, pp.697 - 707, 2014-04 |
| Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs Kim, Kiyeong; Yook, Jong Min; Kim, Junchul; Kim, Heegon; Lee, Junho; Park, Kunwoo; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.11, pp.1891 - 1906, 2013-11 |
| Investigation of LC-VCO Performance Degradation due to TSV-Coupled Noise in 3D IC Kim, Joungho; Lim, Jaemin; Cho, Jonghyun; Lee, Manho; Park, Kunwoo; Lee, Junho, 2013 Asia-Pacific Radio Science Conference (AP-RASC 2013), 2013 Asia-Pacific Radio Science Conference (AP-RASC 2013), 2013-09-03 |
| Temperature-Dependent Through-Silicon Via (TSV) Model and Noise Coupling Lee, Manho; Cho,Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
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