Browse "School of Electrical Engineering(전기및전자공학부)" by Author Paik, Kyung-Wook
Showing results 1 to 12 of 12
| A study on the high frequency performance of solder ACFs joints for flex-on-board applications using coplanar waveguide Zhang, Shuye; Lin, Tiesong; He, Peng; Park, Junyong; Park, Gap Yeol; Song, Huijin; Kim, Joungho; et al, 68th IEEE Electronic Components and Technology Conference, ECTC 2018, pp.2404 - 2409, Institute of Electrical and Electronics Engineers Inc., 2018-05 |
| A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection Zhang, Shuye; Park, Junyong; Park, Gapyeol; Kim, Joungho; Paik, Kyung-Wook; He, Peng, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06 |
| Acoustic Matching Layer Films Using B-Stage Thermosetting Polymer Resins for Ultrasound Transducer Applications Park, Jae-Hyeong; Lee, Sang-Mok; Park, Jongcheol; Lee, Hyunjoo Jenny; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, v.67, no.10, pp.2148 - 2154, 2020-10 |
| Anisotropic Conductive Film (ACF) Flip-chip Interconnect in Over GHz RF Clock Distributioin System Kim, Joungho; Ryu, Woonghwan; Yim, Myung-Jin; Paik, Kyung-Wook, IEEE Adhesive 2000, pp.153 - 158, IEEE, 2000-06 |
| Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low-tolerance embedded capacitors fabrication in organic substrates Cho, SD; Jang, KW; Hyun, JG; Lee, S; Paik, Kyung-Wook; Kim, HS; Kim, Joungho, IEEE TRANCSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.28, no.4, pp.297 - 303, 2005-10 |
| Frequency behavior of embedded epoxy/SrTiO3 composite capacitor materials Lee, S; Hyun, JG; Park, H; Kim, Joungho; Paik, Kyung-Wook, The 55th Electronic Components and Technology Conference, ECTC, pp.1222 - 1227, IEEE, 2005-05-31 |
| High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09 |
| Microwave frequency model of flip-chip interconnects using anisotropic conductive film Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Ahn, Seung Young; Yun, Young-Hwan; Ham, Seog-Heon; et al, Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315, SPIE, 1999-04-06 |
| Microwave Model of Anisotropic Conductive Adhesive Flip-Chip Interconnections for High Frequency Applications Kim, Joungho; Paik, Kyung-Wook; Yim, M; Ryu, W; Jeon, Y, Electronic Components and Technology Conference, Electronic Components and Technology Conference, 1999-05 |
| Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12 |
| Microwave modeling and characterization of anisotropic conductive adhesive flip-chip interconnection Yim, MJ; Jeon, YD; Paik, Kyung-Wook; Ryu, W; Lee, J; Kim, Joungho, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, pp.753 - 758, 1999-12 |
| Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls Ahn, Seung Young; Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Kim, Woo Poung; Paik, Kyung-Wook; et al, Proceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999), pp.421 - 425, 1999-10-18 |
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