Browse "School of Electrical Engineering(전기및전자공학부)" by Author Lee, JS

Showing results 1 to 28 of 28

1
1-Gb/s 80-dB Omega fully differential CMOS transimpedance amplifier in multichip on oxide technology for optical interconnects

Park, SM; Lee, JS; Yoo, Hoi-Jun, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.39, pp.971 - 974, 2004-06

2
A 90 dB 1.32 mW 1.2 v 0.13 mm(2) two-stage variable gain amplifier in 0.18 mu m CMOS

Duong, QH; Lee, JS; Min, SH; Kim, JJ; Lee, Sang-Gug, IEICE TRANSACTIONS ON ELECTRONICS, v.E91C, pp.806 - 808, 2008-05

3
A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps

Chu, KM; Lee, JS; Cho, HS; Park, HyoHoon; Jeon, DY, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.27, no.4, pp.246 - 253, 2004-10

4
An IF Bandpass Filter Based on a Low Distortion Transconductor

Le-Thai, H; Nguyen, HH; Nguyen, HN; Cho, HS; Lee, JS; Lee, Sang-Gug, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.45, pp.2250 - 2261, 2010-11

5
Automatic Commercial Monitoring for TV Broadcasting Using Audio Fingerprinting

Jang, D; Lee, S; Lee, JS; Jin, M; Seo, JS; Lee, S; Yoo, Chang Dong, AES 29, pp.38 - 43, AES 29, 2006-09

6
Characteristics of indium bump for flip-chip bonding used in polymeric-waveguide-integrated optical interconnection systems

Chu, KM; Lee, JS; Cho, HS; Rho, BS; Park, HyoHoon; Jeon, DukYoung, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.43, no.8B, pp.5922 - 5927, 2004-08

7
CHARACTERIZATION OF ION-BEAM DEPOSITED REFRACTORY WNX FILMS ON GAAS

Lee, JS; Park, Chul Soon; Kang, JY; Ma, DS; Lee, Jeong Yong, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.8, no.5, pp.1117 - 1121, 1990-10

8
Effect of rapid thermal annealing on the interface trap density between Pt and (Ba,Sr)TiO3 thin film

Kwak, DH; Jang, BT; Cha, SY; Lee, JS; Lee, Hee Chul, INTEGRATED FERROELECTRICS, v.17, no.1-4, pp.179 - 186, 1997

9
Hydrogen annealing effect on DC and low-frequency noise characteristics in CMOS FinFETs

Lee, JS; Choi, Yang-Kyu; Ha, DW; Balasubramanian, S; King, TJ; Bokor, J, IEEE ELECTRON DEVICE LETTERS, v.24, no.3, pp.186 - 188, 2003-03

10
Improvement of Adhesion and Microwave Transmission Characteristics of Indium Bump by Silver Coating for Low Temperature Flip-Chip Application

Jeon, Duk Young; Chu, KM; Lee, JS; Park, HyoHoon, 2005 GIST/KAIST/Kyoto/Tohoku university joint symposium, pp.13 -, 2005

11
Improvement of adhesion and microwave transmission characteristics of indium bump by silver coating for low temperature flip-chip applications

Chu, KM; Choi, JH; Lee, JS; Cho, HS; Park, SeongOok; Park, HyoHoon; Jeon, DukYoung, Materials, Intergration and Packaging Issues for High-Frequency Devices II, pp.75 - 80, Materials Research Society Symposium, 2004-11-29

12
Low Phase Noise and High Output Power K-band MMIC VCO Utilizing a Miniaturized Hairpin Resonator and a Three-terminal p-HEMT Varactor

Myung, Noh-Hoon; Hwang, CG; Lee, JS; Song, JI, 2002 APMC (Asia-Pacific Microwave Conference), pp.1394 - 1397, 2002

13
Low Voltage Current-Reused Pseudo-Differential Programmable Gain Amplifier

Nguyen, HH; Lee, JS; Lee, Sang-Gug, IEICE TRANSACTIONS ON ELECTRONICS, v.E93C, pp.148 - 150, 2010-01

14
Low-frequency noise characteristics in p-channel FinFETs

Lee, JS; Choi, Yang-Kyu; Ha, D; King, TJ; Bokor, J, IEEE ELECTRON DEVICE LETTERS, v.23, no.12, pp.722 - 724, 2002-12

15
Low-frequency noise characteristics of ultrathin body p-MOSFETs with molybdenum gate

Lee, JS; Ha, DW; Choi, Yang-Kyu; King, TJ; Bokor, J, IEEE ELECTRON DEVICE LETTERS, v.24, no.1, pp.31 - 33, 2003-01

16
MMIC active resonator using gate-to-source resistive feedback and its power characteristics

Lee, JS; Kwon, Young Se, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, pp.1071 - 1075, 1999-12

17
Molybdenum gate work function engineering for ultra-thin-body silicon-on-insulator (UTB SOI) MOSFETs

Ha, DW; Ranade, P; Choi, Yang-Kyu; Lee, JS; King, TJ; Hu, CM, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.42, no.4B, pp.1979 - 1982, 2003-04

18
n-Dimensional cauchy neighbor generation for the fast simulated annealing

Nam, D; Lee, JS; Park, Cheol Hoon, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E87D, no.11, pp.2499 - 2502, 2004-11

19
Optimization of low temperature flip-chip bonding for VCSEL arrays for polymeric-waveguide-integrated optical interconnection systems

Jeon, Duk Young; Chu, KM; Lee, JS; Rho, BS; Cho, HS; Park, Hyo Hoon, Microoptics Conference, pp.402 - 405, 2003

20
Optoelectronic and microwave characteristics of silver coated indium bumps for low temperature flip-chip applications

Chu, KM; Choi, JH; Lee, JS; Cho, HS; Park, SeongOok; Park, HyoHoon; Jeon, DukYoung, ELECTRONICS LETTERS, v.40, no.23, pp.1508 - 1509, 2004-11

21
PROPERTIES OF WNX FILMS AND WNX/GAAS SCHOTTKY DIODES PREPARED BY ION-BEAM ASSISTED DEPOSITION TECHNIQUE

Lee, JS; Park, Chul Soon; Yang, JW; Kang, JY; Ma, DS, JOURNAL OF APPLIED PHYSICS, v.67, no.2, pp.1134 - 1136, 1990-01

22
Self-organizing neural networks by construction and pruning

Lee, JS; Lee, H; Kim, JY; Nam, D; Park, Cheol Hoon, IEICE TRANSACTIONS ON INFORMATION AND SYSTEMS, v.E87D, no.11, pp.2489 - 2498, 2004

23
Simple K-band MMIC VCO utilizing a miniaturized hairpin resonator and a three-terminal p-HEMT varactor with low phase noise and high output power properties

Hwang, CG; Lee, JS; Kim, JH; Myung, Noh-Hoon; Song, JI, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.13, pp.229 - 231, 2003-06

24
Spectrum-sliced fiber amplifier light source for multi-channel WDM applications

Chung, Yun Chur; Lee, JS; DiGiovanni, DJ, Optical Fiber Communication Conference, 1994

25
Spectrum-sliced fiber amplifier light source with a polarization-insensitive electroabsorption modulator

Chung, Yun Chur; Lee, JS; Wood, TH; Joyner, CH; Meester, JP; Stone, J; Presby, HM, Optical Amplifiers and Their Applications, 1994

26
Sublithographic nanofabrication technology for nanocatalysts and DNA chips

Choi, Yang-Kyu; Lee, JS; Zhu, J; Somorjai, GA; Lee, LP; Bokor, J, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.21, no.6, pp.2951 - 2955, 2003-11

27
THERMAL STABILITIES AND MICROSTRUCTURES OF TUNGSTEN COMPOUND CONTACTS ON N-GAAS FABRICATED BY LOW-ENERGY ION-BEAM-ASSISTED DEPOSITION

Park, Chul Soon; Lee, JS; Kang, JY; Lee, Jeong Yong, APPLIED PHYSICS LETTERS, v.59, no.14, pp.1767 - 1769, 1991-09

28
Window-based congestion control to improve TCP fairness and utilization for wide-bandwidth networks

Lim, Jong-Tae; Lee, JS, ICCAS 2008, pp.401 - 405, 2008-10-15

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