Browse "School of Electrical Engineering(전기및전자공학부)" by Author Jeong, Youchul
Showing results 1 to 7 of 7
| A 2-dimensional distributed equivalent circuit model of EBG power distribution network Lee, Junho; Jeong, Youchul; Kim, Joungho, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, pp.115 - 118, IEEE, 2005-10-24 |
| Accurate Measurement of Power/Ground Impedance with Embedded Film Capacitor using Two-port Self-Impedance Measurement Technique Kim, Hyungsoo; Jeong, Youchul; Park, Joungbae; Lee, SeokKyu; Hong, JongKuk; Hong, Youngsoo; Kim, Joungho, IEEE 5th Electronics Packaging Technology Conference, pp.51 - 54, IEEE, 2003-12-10 |
| An Efficient Hybrid Transmission Line Method (HTLM) for Analysis of Perforated Package Power/Ground Plane Kim, Joungho; Jeong, Youchul; Kim, Hyungsoo; Kim, Jingook; Park, Jongbae, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.179 - 183, IEEE, 2002-10 |
| Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system Jeong, Youchul; Kim, Hyungsoo; Kim, Jingook; Park, Jongbae; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.199 - 202, IEEE, 2003-10-27 |
| Analysis of Via Distribution Effect on Multi-layered Power/Ground Transfer Impedance of High-performance Packages Kim, Joungho; Kim, Hyungsoo; Kim, Jingook; Jeong, Youchul; Park, Jongbae, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.171 - 174, IEEE, 2002-10 |
| Significant Reduction of Power/Ground Inductive Impedance and Simultaneous Switching Noise by Using Embedded Film Capacitor Kim, Hyungsoo; Jeong, Youchul; Park, Jongbae; Lee, SeokKyu; Hong, JongKuk; Hong, Youngsoo; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.129 - 132, IEEE, 2003-10-27 |
| Tapered Slot Shape on Slotted Reference Plane of Multi-layer PCB for Reduction of Crosstalk and Radiated Emission Kim, Joungho; Kim, Jingook; Kim, Hyungsoo; Jeong, Youchul, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.275 - 278, IEEE, 2002 |
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