Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system
- Publisher
- IEEE
- Issue Date
- 2003-10-27
- Language
- English
- Citation
IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.199 - 202
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
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