Showing results 1 to 7 of 7
A Compact and Wide-Band Passive Equalizer Design Using a Stub With Defected Ground Structure for High Speed Data Transmission Shim, Yu-Jeong; Lee, Woo-Jin; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Joung-Ho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.20, pp.256 - 258, 2010-05 |
A Wide-Band Passive Equalizer Design on PCB Based on Near-End Crosstalk and Reflections for 12.5 Gbps Serial Data Transmission Song, Eak-Hwan; Cho, Jeong-Hyeon; Lee, Woo-Jin; Shin, Min-Chul; Kim, Joung-Ho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.18, no.12, pp.794 - 796, 2008-12 |
Eye-diagram estimation based on fourier-series signal decomposition technique in high-speed interconnects = 고속 신호선에서의 푸리에급수 신호 분해 기법 기반의 아이다이어그램 예측link Cho, Jeong-Hyeon; 조정현; et al, 한국과학기술원, 2011 |
High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Kim, Joo-Hee; Pak, Jun-So; Cho, Jong-Hyun; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Hee-Gon; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.181 - 195, 2011-02 |
Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data Transmission Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Joung-Ho; Shim, Yu-Jeong; Kim, Ga-Won, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.410 - 420, 2010-05 |
Recent advances in electromagnetic compatibility of 3D-ICS - Part II Sicard, Etienne; Jianfei, Wu; Shen, Rongjun; Li, Er-Ping; Liu, En-Xiao; Kim, Joungho; Cho, Jeong-Hyeon; et al, IEEE Electromagnetic Compatibility Magazine, v.5, no.1, pp.65 - 74, 2016 |
Recent advances in electromagnetic compatibility of 3D-ICS - Part II Sicard, Etienne; Jianfei, Wu; Shen, Rongjun; Li, Er-Ping; Liu, En-Xiao; Kim, Joungho; Cho, Jeong-Hyeon; et al, IEEE Electromagnetic Compatibility Magazine, v.5, no.1, pp.65 - 74, 2016 |
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