Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 8801 to 8820 of 51065
| Analysis of threshold decomposition and continuity for median-type filters and its application to nonlinear filter design = 미디언형 필터의 임계분해 및 연속성에 관한 해석과 비선형 필터 설계에 대한 이의 응용link Jeong, Byung-Jang; 정병장; et al, 한국과학기술원, 1997 |
| Analysis of through glass via (TGV) noise coupling effect to noise figure of 2.4GHz LNA on glass interposer Hwang, Insu; Kim, Jihye; Kim, Youngwoo; Cho, Jong-Hyun; Kim, Joungho; Sundaram, Venky; Tummala, Rao, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.85 - 88, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Analysis of Throughput and Delay of a High-speed Slotted Ring Based on Lumped Modeling W.Y.Jung; C.K.Un, IEEE TRANSACTIONS ON COMMUNICATIONS, v.40, no.5, pp.860 - 862, 1992-05 |
| Analysis of throughput and efficient block size based polling scheme for IEEE 802.11e Wireless LANs Lee I.-G.; Yoon S.-R.; Park, Sin Chong, 2005 IEEE International Conference on Communications, ICC 2005, v.5, pp.3467 - 3473, 2005-05-16 |
| Analysis of throughput and energy consumption in a ZigBee network under the presence of bluetooth interference Chong, J.W.; Hwang, H.Y.; Jung, C.Y.; Sung, Dan Keun, 50th Annual IEEE Global Telecommunications Conference, GLOBECOM 2007, pp.4749 - 4753, 2007-11-26 |
| Analysis of throughput in a ZigBee network under the presence of WLAN interference Chong, J.W.; Hwang, H.Y.; Jung, C.Y.; Sung, Dan Keun, ISCIT 2007 - 2007 International Symposium on Communications and Information Technologies, pp.1166 - 1170, 2007-10-16 |
| ANALYSIS OF TM SCATTERING FROM FINITE RECTANGULAR GROOVES IN A CONDUCTING PLANE PARK, TJ; Eom, Hyo Joon; YOSHITOMI, K, JOURNAL OF THE OPTICAL SOCIETY OF AMERICA A-OPTICS IMAGE SCIENCE AND VISION, v.10, no.5, pp.905 - 911, 1993-05 |
| Analysis of Transconductance (g(m)) in Schottky-Barrier MOSFETs Choi, Sung-Jin; Choi, Chel-Jong; Kim, Jee-Yeon; Jang, Moon-Gyu; Choi, Yang-Kyu, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.58, no.2, pp.427 - 432, 2011-02 |
| Analysis of Transmission Line Discontinuities by 3-Dimensional Finite-Element Method Lee, S.S.; Ahn, C.H.; Jeong, B.S; Lee, Soo-Young; Ra, J.W., IEEE MTT Korea Chapter Seminar, 1990-11 |
| Analysis of transmission through slit and multiple grooves structures for biosensors Kim, Bong Ho; Nakarmi, Bikash; Won, Yong Hyub, SPIE Photonics West 2015, SPIE, 2015-02-08 |
| Analysis of Transmission-Line Discontinuities by 3-Dimensional Finite Element Method S.S.Lee; C.H.Ahn; B.S.Jeong; S.Y.Lee, 전자공학회논문지, v.28, no.5, pp.355 - 359, 1991 |
| Analysis of Trapped Charges in Dopant-Segregated Schottky Barrier-Embedded FinFET SONOS Devices Choi, Sung-Jin; Han, Jin-Woo; Jang, Moon-Gyu; Choi, Yang-Kyu, IEEE ELECTRON DEVICE LETTERS, v.30, no.10, pp.1084 - 1086, 2009-10 |
| Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs Song, T; Liu, C; Kim, DH; Lim, SK; Cho, J; Kim, J; Pak, JS; et al, 12th International Symposium on Quality Electronic Design, ISQED 2011, pp.122 - 128, ISQED 2011, 2011-03-14 |
| Analysis of ultimate capacity and transparency cost of all-optical transport networks based on node throughput Kim, HD; Lee, Chang-Hee, Proceedings of the 1999 Pacific Rim Conference on Lasers and Electro-Optcis (CLEO/PACIFIC Rim '99), v.4, pp.1285 - 1286, 1999-08-30 |
| Analysis of Ultra Stable Tracking Oscillator with Wide Frequency Control Range Na, JR; Park, KC; Bien, Zeung nam, JOURNAL OF THE KTA, v.4, pp.135 - 140, 1991-01 |
| Analysis of Uplink Co-Channel Interference on the Cellular Networks Bae, Jimin; Park, Eunhye; Han, Youngnam, 88th IEEE Vehicular Technology Conference (VTC-Fall), IEEE, 2018-08 |
| Analysis of vertical handover latency for IEEE 802.21-enabled Proxy Mobile IPv6 Song, H.; Kim, J.; Lee, J.; Lee, Hwang Soo, 13th International Conference on Advanced Communication Technology: Smart Service Innovation through Mobile Interactivity, ICACT 2011, pp.1059 - 1063, ICACT 2011, 2011-02-13 |
| Analysis of Vertical PCB Connector Induced Via Stub Reduction in High Speed Serial Link Kim, Dong-Hyun; Kim, Joungho; Kim, Heegon; Lim, Jaemin; Jeon, Yeseul; Koh, Wee Jin; Chang, Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19 |
| Analysis of Via Distribution Effect on Multi-layered Power/Ground Transfer Impedance of High-performance Packages Kim, Joungho; Kim, Hyungsoo; Kim, Jingook; Jeong, Youchul; Park, Jongbae, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.171 - 174, IEEE, 2002-10 |
| Analysis of Voice/Data Multiplexers with an ARQ Scheme Based on Markov Renewal Process Modeling C.K.Jeong; C.K.Un, COMPUTER COMMUNICATIONS, v.15, no.7, pp.438 - 446, 1992-09 |
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