Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 18061 to 18120 of 22781
| Thermoelectric Characteristics of Si/silicide Heterostructure Layers Fabricated by RF Magnetron Sputtering and RTA Techniques Ha, Jae Kwon; Jeon, Buil; Yoon, Giwan, IUMRS-ICEM 2018, International Union of Materials Research Societies, The Materials Research Society of Korea, 2018-08-21 |
| Thermoelectric characteristics of silicon/silicide hetero-junction structured thermoelectric modules Choi, Won Chul; Zyung, Taehyoung; Kim, Soojung; Jeon, Hyojin; Shin, Min-Cheol; Jang, Moongyu, NANO KOREA 2014, NANO KOREA, 2014-07-03 |
| Thermoelectric Characterization of Si/Silicide-Heterostructure Layers Fabricated by RF Magnetron Sputtering 이지화; 하재권; 윤종세; 윤기완, 2017년도 한국재료학회 추계학술대회, 사단법인 한국재료학회, 2017-11-16 |
| Thermoelectric effect of silicide and silicon hetero-junction structured devices Wonchul Choi; Shin, Mincheol, E-MRS 2013 SPRING MEETING, E-MRS, 2013-05-27 |
| Thermoelectric Properties of p-type Sb2Te3 and n-type Bi2Te3 Thick Films Deposited by Screen-Printing Technique Kim, Sun Jin; We, Ju Hyung; Kim, Gyung Soo; Cho, Byung Jin, 2nd ENGE 2012 (Int'l Conference on Electrical Materials and Nanotechnology for Green Environment), The korean Institute of Metals and Materials, 2012-09-19 |
| Thermoelectric properties of silicide/silicon hetero-junction structure Choi, Wonchul; Park, Young Sam; Huyn, Younghoon; Zyung, Taehyoung; Kim, Jaehyun; Kim, Soojung; Hyojin Jeon; et al, ENGE-12, 2012-09-18 |
| Thermoelectric Properties of the Pt silicide/silicon Laminate Structured p-type Devices Choi, Wonchul; Shin, Mincheol, 한국물리학회 2013 가을 학술논문 발표회, 한국물리학회, 2013-10-30 |
| Thermopower of Si nanowires under strong impurity scattering Oh, Jung Hyun; Shin, Mincheol; Lee, Seok-Hee, 18th international conference on electron dynamics in semiconductors, optoelectronics, Univ. of Tokyo, 2013-07-23 |
| Thick Metal CMOS Technology on High Resistivity Substrate for Monolithic 900 MHz and 1.9 GHz CMOS LNAs Kim, C.S.; Park, M.; Kim, C.h; Yu, H.K; Lee, Kwyro; Kim, D.Y; Cho, H., IEEE MTT-S International Microwave Symposium Digest, pp.573 - 576, IEEE, 1999 |
| Thickness Dependence of Bias Field in Ferroelectric Polymer Thin Film 이희철, 제 17회 반도체 학술대회, 제 17회 반도체 학술대회, 2010 |
| Thin film silicon solar cells on ZnO/SnO2/glass substrate Lee, Y.J.; Shin, J.K.; Lim, Koeng Su, 208th Meeting of The Electrochemical Society, pp.835 -, 2005-10-16 |
| Thin film silicon solar cells on ZnO/SnO2/glass substrate Lee ,Y.J.; Shin, J.K.; Lim, Koeng Su, Solid-State Posters (General), pp.11 - 14, 2005-10-16 |
| Thin Film Thermoelectric Module using Screen Print Method Cho, Byung Jin; Choi, Kyung Cheol, 29th International Conference on Thermoelectrics, 29th International Conference on Thermoelectrics, 2010-05-31 |
| Thin Films of Nano-and Proto-Crystalline Silica for Solar Photovoltaics Produced Using PHoto-CVD: the Key Role of Spin Defects Lim, Koeng Su; Shevaleevskiy, O, Molecular and Nanoscale Systems for Energy Conversion (MEC 2007), 2007 |
| Thin nickel oxide films for micro-bolometers Kim, D.S.; Kwon, I.W.; Lee, Y.S.; Lee, Hee Chul, Infrared Technology and Applications XXXV, v.7298, 2009-04-13 |
| Thin-Film Vacuum Packaging Based on Porous Anodic Alumina (PAA) for Infrared (IR) Detection Jeon, Gwang-Jae; Kim, Woo Young; Lee, Hee Chul, IEEE sensors, pp.457 - 460, IEEE, 2012-10-29 |
| Thinning deep neural networks for sketch recognition Ahn, Pyunghwan; Shin, Dong Hoon; Kim, Junmo, 2016 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA 2016, Institute of Electrical and Electronics Engineers Inc., 2016-12 |
| Thinning deep neural networks for sketch recognition PYUNGHWAN, AHN; Shin, Donghoon; Kim, Junmo, APSIPA ASC 2016, 한국방송미디어공학회, 2016-12-14 |
| This ain't your dose: Sensor Spoofing Attack on Medical Infusion Pump Park, Youngseok; Son, Yunmok; Shin, Hocheol; Kim, Dohyun; Kim, Yongdae, 10th USENIX Workshop on Offensive Technologies, USENIX, 2016-08-09 |
| Thread-based software synthesis for embedded system design Shin, Youngsoo; Choi, K, Proc. European Design & Test Conf. (ED&TC), , pp.282 - 286, ACM Press, 1996-03 |
| Three Basic Problems in Roboitcs Xu, Y.; Lee, Ju-Jang, International Conference on Manufacturing Automation, International Conference on Manufacturing Automation, 1992 |
| Three Dimensional Integration of Graphene and Silicon CMOS Hybrid Circuits Hong, Seul Ki; Oh, Joong Gun; Kim, Choong Sun; Hwang, Wan Sik; Cho, Byung Jin, The 8th International Conference on Recent Progress in Graphene/2D Research, SKKU Advanced Institute of Nano Technology, 2016-09-27 |
| Three Dimensional Marker-Driven Watershed Transform for Volume and Intensity Measurement from Medical Images: Preliminary Results Kim, Desok; Chae, Yong-su, International Conference on Hybrid Information Technology(ICHIT 2006), ICHIT, 2006-11-09 |
| Three dimensional volume measurement of mouse abdominal fat in magnetic resonance images Chae, Yong-su; Jeong, Myeong Gi; Kim, Desok, HEALTHCOM 2007: Ubiquitous Health in Aging Societies - 2007 9th International Conference on e-Health Networking, Application and Services, pp.252 - 255, 2007-06-19 |
| Three Phase Diode Rectifier Employing Soft Switching Methods Moon, Gun Woo; Lee, Jung Hoon; Youn, Myung Joong, '93 KIEE Summer Conference, pp.847 - 849, KIEE, 1993-07 |
| Three Phase Sine Wave voltage Source Inverter Using the Soft Switched Resonant Poles Cho, Gyu-Hyeong, pp.48 - 53, IEEE, 1989-11 |
| Three phase three-level PWM switched voltage source inverter with zero neutral point potential Oh, Won-Sik; Han, Sang-Kyoo; Choi, Seong-Wook; Moon, GunWoo, Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual (Volume:6 ), pp.4405 - 4410, IEEE, 2004-06-20 |
| THREE-DIMENSIONAL (3-D) RESHAPING TECHNIQUE IN MEMS DEVICES BY SOLELY ELECTRICAL CONTROL WITH ULTRAFINE TUNING RESOLUTION Yoon, Yong-Hoon; Han, Chang-Hoon; Yoon, Jun-Bo, The 27th IEEE International Conference on Micro electro Mechanical System, MEMS 2014, pp.660 - 663, IEEE, 2014-01-30 |
| Three-dimensional phase-field based quantum transport simulations of polar topological states Lee, Hyeongu; Shin, Mincheol, 2023 International Electron Devices Meeting (IEDM), Institute of Electrical and Electronics Engineers Inc., 2023-12-12 |
| Three-level LLC SRC for high and wide input voltage applications Lee, Il Oun; Moon, GunWoo, Power Electronics and ECCE Asia (ICPE & ECCE), 2011 IEEE 8th International Conference on, pp.52 - 59, IEEE, 2011-05-30 |
| Three-level space vector PWM in low index modulation region avoiding narrow pulse problem Liu, Hyo L.; Cho, Gyu-Hyeong, Proceedings of the 1993 IEEE 24th Annual Power Electronics Specialist Conference, pp.257 - 262, IEEE, 1993-06-20 |
| Three-level 의사공진형 PWM 컨버터 김재현; 이일운; 김영도; 김재국; 문건우, 2010년도 전력전자학술대회, pp.160 - 161, KIPE, 2010-07 |
| Three-Phase Boost-Converter Based PMIC for Thermal Electric Generator Application Tran-Dinh, Thinh; Pham, Hieu Minh; Vu, Tien-Lam; Pham-Nguyen, Loan; Lee, Sang-Gug, 15th Annual IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2019, pp.205 - 208, Institute of Electrical and Electronics Engineers Inc., 2019-11 |
| Three-Phase Magnetic Field Design for Low EMI and EMF Automated Resonant Wireless Power Transfer Charger for UAV Kim, Joungho; Kim, Hongseok; Jung, Daniel H.; Yoon, Kibum; Cho,Yeonje; Kong, Sunkyu; Kwack, Younghwan, IEEE Wireless Power Transfer Conference 2015, IEEE Wireless Power Transfer Conference 2015, 2015-05-13 |
| Three-Switch Active-Clamp Forward Converter with Low Switch Voltage Stress Park, Ki-Bum; Kim, Chong-Eun; Moon, GunWoo; Youn, Myung-Joong, Applied Power Electronics Conference and Exposition, 2009. APEC 2009. Twenty-Fourth Annual IEEE, pp.1390 - 1396, IEEE, 2009-02-15 |
| Three-Switch Active-Clamp Forward Converter with Low Voltage Stress Park, Ki-Bum; Kim, Chong-Eun; Moon, Gun-Woo; Youn, MyungJoong, 2008년 전력전자학술대회, pp.505 - 507, KIPE, 2008-06-30 |
| Three-switch active-clamp forward converter with reduced voltage stress Park, KB; Kim, CE; Moon, GW; Youn, Myung Joong, IEEE APEC, IEEE, 2010-04 |
| Three-switch LLC resonant converter for high efficiency adapter with universal input voltage Lee, Jeong-Soo; Kim, Chong-Eun; Choi, Jae-Won; Baek, Jae-Il; Yeon, Cheol O; Moon, Gun-Woo, Future Energy Electronics Conference and ECCE Asia (IFEEC 2017 - ECCE Asia), 2017 IEEE 3rd International, IEEE, 2017-06-07 |
| Threshold analysis of a sequential detection scheme with locally optimum test statistic Choi, S.W.; Lee, J.; Kwon, H.; Park, S.R.; Song, Iickho, Fall Confer. Inst. EEK, pp.217 - 220, 대한전자공학회, 2005-11 |
| Threshold based Channel Admission Control in IPTV System Choi, JunKyun, ICOIN 2007, 2007 |
| Threshold Boolean Filters Lee, Yong-Hoon; Lee, K.D., Proc. Canadiam Conf. on Electrical and Computer Eng., 1992-09 |
| threshold current density InGaAs surface-emitting lasers buried by amorphous GaAs Park, HyoHoon; Yoo, BS; Lee, EH; Park, MS; Ahn, BT, International Conference on Solid State Devices and Material 1995s, pp.443 - 445, 1995-08-21 |
| Threshold Detection for Timing Recovery Moon, Jaekyun, International Magnetics Conference, pp.0 - 0, 2000-04-12 |
| Threshold Voltage Shift by Quantum Confinement in Ultra-thin Body Device Choi, Yang-Kyu; Ha, Daewon; King, Tsu-Jae; Hu, Chenming, IEEE, pp.85 - 86, 2001-06 |
| Threshold Voltage Shift Due to the Change of Impurity Type of Polysilicon in Heavily Doped Polysilicon Gate MOSFET Kim, Choong Ki, International Symposium on VLSI Technology,Systems and Applications, pp.170 - 173, 1983 |
| Threshold-based admission control method for multicast environment Jo, S.K.; Guha, D.; Choi, JunKyun; Choi, S.G.; Lee, J.H., 8th International Conference Advanced Communication Technology, ICACT 2006, v.1, pp.55 - 59, 2006-02-20 |
| Through silicon via (TSV) equalizer Kim, Joungho; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 123, 2009-10-19 |
| Through Silicon Via (TSV) Noise Coupling Effects on RF LC-VCO in 3D IC Kim, Joung-Ho; Lim,Jaemin; Cho,Jonghyun; Lee,Manho; Jung,Danial H; Choi,sumin; Lee,Hyunsuk, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 2014-10-26 |
| Through Silicon Via (TSV) shielding structures Cho, J.; Kim, Joungho; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25 |
| Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance Piersanti, S; De Paulis, F; Orlandi, A; Kim, Dong-Hyun; Cho, Jong-Hyun; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2015, pp.567 - 572, Institute of Electrical and Electronics Engineers Inc., 2015-08 |
| Through-Silicon Via (TSV) Depletion Effect Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
| Throughput analysis of 1x EV-DO system with multi cells Choi, Wan; Choi, D.; Lee, J.; Lee, S., IEICE International Technical Conference on Circuit/Systems, Computer, and Communications (ITC-CSCC), pp.1924 - 1927, ITC-CSCC, 2002-07-16 |
| Throughput analysis of a DS/SSMA unslotted ALOHA system with two user classes So, Jae Woo; Cho, Dong-Ho, International Conference on Communications (ICC2001), pp.1985 - 1989, IEEE, 2001-06-11 |
| Throughput analysis of IEEE 802.11e wireless LANs and efficient Block Ack mechanism Lee I.-G.; Yoon S.-R.; Park, Sin Chong, IEEE International Symposium on Communications and Information Technologies: Smart Info-Media Systems, ISCIT 2004, v.1, pp.290 - 295, 2004-10-26 |
| Throughput and Delay performance of Dynamic Spectrum Management over DSL Arrivals Yi, Yung; Tsiaflakis, Paschalis; Chiang, Mung; Moonen, Marc, IEEE Globecom, IEEE, 2008-11 |
| Throughput Comparisons of Single- and Two-Hop Celluar Systems with Single or Multiple Antennas Sung, Dan Keun; Yoon, S.H.; Baek, S.Y.; Ban, T.W., JCCI 2009, 2009-04 |
| Throughput enhancement for short packets in the wireless packet networks Kwon, Y.-H.; Oh, M.-K.; Park, Dong-Jo, 2004 7th International Conference on Signal Processing Proceedings (ICSP'04), v.3, pp.1833 - 1836, 2004-08-31 |
| Throughput Enhancement of IEEE 802.11 MAC by antenna selection for IEEE 802.11a devices Lee J.-H.; Lee S.; Park, Sin Chong, 9th International Conference on Advanced Communication Technology, ICACT 2007, v.3, pp.1732 - 1733, 2007-02-12 |
| Throughput Enhancement of Secondary Transmitter under Target Physical Layer Security Rate Koh, Jeongwan; Myung, Jungho; Kang, Joonhyuk, 24th Annual IEEE International Symposium on Personal, Indoor and Mobile Radio Communications, pp.513 - 517, IEEE, 2013-09-09 |
| Throughput enhancement through arranged power-saving mechanism in wireless LAN Hyu-dae Kim; Cho, Dong-Ho, 2006 IEEE International Conference on Communications, ICC 2006, pp.4780 - 4785, IEEE, 2006-07-11 |
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