Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 12601 to 12620 of 22817
| Modeling of Frame Difference Image Based on Ridge-signal and Application to Low-rate Video Data Compression Kim, Seong-Dae; Jang, SH, Proceeding of ISITA, pp.547 - 550, 1990 |
| Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation Kim, J.; Jeong, Y.; Kim, J.; Lee, J.; Shim, J.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.16 - 19, IEEE, 2006-08-14 |
| Modeling of Interaction with the Environment Using Sensor Inputs in Human-friendly Software Robot Lee, Joon-Yong; Kim, Chang-Hyun; Lee, Ju-Jang, KACC, pp.582 - 585, KACC, 2005-10 |
| Modeling of Interconnected Multimachine Power System with a Generator-Exciter System Shin, J.H.; Lee, Ju-Jang, Conf. on KIEE Tadjon, pp.3 - 13, KIEE, 1996-12 |
| Modeling of Power Consumption for Macro-, Micro-, and RRH-based Base Station Architectures Jung, BH; Sung, Dan Keun, IEEE VTC 2014 Spring, IEEE VT Society, 2014-05-20 |
| MODELING OF QUANTUM PARALLEL RESONANT CONVERTERS - A NEW PARALLEL RESONANT CONVERTERS CONTROLLED BY INTEGRAL CYCLE MODE Jeong, gyu bum; Cho, Gyu-Hyeong, Power Electronics Specialists Conference, 1989. PESC '89 Record., 20th Annual IEEE, pp.744 - 751, IEEE, 1989-06 |
| Modeling of quantum series resonant converters - controlled by integral cycle mode Joung, G.B.; Rim, Chuntaek; Cho, Gyu-Hyeong, Conference Record of the 1988 IEEE Industry Applications Society Annual Meeting, pp.821 - 826, 1988-10 |
| Modeling of Simultaneous Switching Noise Effects on Jitter Characteristics of Delay Locked Loop in a Hierarchical System of Chip-Package-PCB Shim, Yujeong; Bae, Bumhee; Koo, Koungchoul; Kim, Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2011, 2011-11-07 |
| Modeling of terminal mobility to evaluate the number of location updates Chung, Min Young; Kim, Tai Suk; Cho, Ho Shin; Sung, Dan Keun, Proceedings of the 1997 IEEE International Conference on Communications, ICC. Part 3 (of 3), v.3, pp.1266 - 1270, 1997-06-08 |
| Modeling of the Emotional Model with Friendship for Familiarity of Robot Choi, Tae-Yong; Lee, Joon-Yong; Shin, Jin-Ho; Lee, Ju-Jang, IEEE IRS/RSJ International Conference on Intelligent Robots and Systems, pp.2437 - 2442, IEEE, 2005-08-02 |
| Modeling of Thermal Conductivity Extraction of Thin Film Thermoelectric Materials Using a Screen Printing Technique We, Ju Hyung; Kim, Sun Jin; Cho, Byung Jin, 6th Annual Energy Harvesting Workshop, 2011-08 |
| Modeling of Through-silicon Via (TSV) with an hmbedded High-density Metal-insulator-metal (MIM) Capacitor Cho, Kyunjun; Kim, Youngwoo; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Park, Hyunwook; Kim, Seongguk; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 |
| Modeling Photo Composition and Its Application to Photo Re-arrangement Kweon, In-So; Park, Jaesik; Lee, Joon-Young; Tai, Yu-Wing, IEEE International Conference on Image Processing, IEEE, 2012-10 |
| Modeling student's handwritten examination data and its application using a tablet computer Kim, Youngjae; Lim, Cheolil; Choi, Haewook; Hahn, Minsoo, International Conference on IT Convergence and Security, ICITCS 2012, pp.861 - 865, Springer, 2012-12-05 |
| Modeling the calibration pipeline of the lytro camera for high quality light-field image reconstruction Tai, Yu-Wing; Donghyeon Cho; Minhaeng Lee; Sunyeong Kim, ICCV2013 IEEE International Conference on Computer Vision, pp.3280 - 3287, IEEE International Conference on Computer Vision, 2013-12-03 |
| Modeling the user preference on broadcasting contents using Bayesian networks Kang, S.; Lim, J.; Kim, MunChurl, Visual Communications and Image Processing 2004, v.5308, no.PART 2, pp.958 - 967, 2004-01-20 |
| Modeling, analysis and control of static VAR compensator using three-level inverter Cho, G. C.; Choi, N. S.; Rim, Chuntaek; Cho, Gyu-Hyeong, Industry Applications Society Annual Meeting, 1992., Conference Record of the 1992 IEEE , pp.837 - 843, IEEE, 1992 |
| Modeling, Measurement, and Analysis of TSV Channel and Defects for 2.5D/3D IC Failure Analysis Kim, Joungho; Jung, Daniel H; Bae, Hyun-Cheol; Choi, Kwang-Seong; Youn, Joong Suk, DesignCon 2017, DesignCon 2017, 2017-02-01 |
| Modeling, simulation and measurement of on-chip interconnects with extremely thin Si substrate for flexible electronics Jeong, Seungtaek; Lee, Seongsoo; Sim, Boogyo; Hong, Seokwoo; Park, Hyunwook; Kim, Subin; Kim, Joungho; et al, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Modelling and analysis of ARQ mechanisms for wireless multi-hop relay system Jeon, Soo-Yong; Cho, Dong-Ho, 2008 IEEE 67th Vehicular Technology Conference-Spring, VTC, pp.2436 - 2440, IEEE, 2008-05-11 |
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