Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 20361 to 20380 of 51082
| High-Field Electron Transport and High Saturation Velocity in Multilayer Indium Selenide Transistors Seok, Yongwook; Jang, Hanbyeol; Choi, Yitaek; Ko, Yeonghyeon; Kim, Minje; Im, Heungsoon; Watanabe, Kenji; et al, ACS NANO, v.18, no.11, pp.8099 - 8106, 2024-03 |
| High-field electron transport in InSe and its applications 이가영, 제 9회 한국그래핀 · 2차원 소재 심포지엄, 한국그래핀학회, 2022-07-12 |
| High-field magnetic resonance techniques for brain research Kim, Dae-Shik; Garwood, M, CURRENT OPINION IN NEUROBIOLOGY, v.13, no.5, pp.612 - 619, 2003-10 |
| High-field saturation velocity in InSe nanosheet on hBN Seok, YongWook; Jang, Hanbyeol; Im, Heungsoon; Lee, Kayoung, 2023 Advanced Epitaxy for Freestanding Membranes and 2D Materials, Massachusetts Institute of Technology, 2023-07-10 |
| HIGH-FIELD-INDUCED LEAKAGE IN ULTRATHIN N2O OXIDES Yoon, Giwan; JOSHI, AB; KIM, J; KWONG, DL, IEEE ELECTRON DEVICE LETTERS, v.14, no.5, pp.231 - 233, 1993-05 |
| High-finesse AlxOy/AlGaAs nonabsorbing optical cavity Shin, HE; Ju, YG; Song, HW; Song, DS; Han, IY; Ser, JH; Ryu, HY; et al, APPLIED PHYSICS LETTERS, v.72, no.18, pp.2205 - 2207, 1998-05 |
| High-frequency Displacement Monitoring Robot System Using Sensor Fusion of a Visually Servoed Paired Structured Light System with an Inertial Measurement Unit Jeon, Haemin; Kim, Youngjae; Myung, Hyun, ICCES 2014 (Int'l Conf. on Computational & Experimental Engineering and Sciences), ICCES'14 Organizing Committee, 2014-06-13 |
| High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J.; Kim, DongHyun; Son, Kyungjune; Kim, Subin; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.12, pp.2152 - 2162, 2018-12 |
| High-frequency Electrical Model of Chip-to-Chip Via Interconnection for 3-D Chip Stacking Package Kim, Joungho; Ryu, Chunghyun; Chung, Daehyun; Lee, Junho; Lee, Kwangyong; Oh, Taesung, IEEE 14th(13) Topical Meeting on Electrical Performance of Electronic Packaging, pp.151 - 154, IEEE, 2005-10 |
| High-frequency electrical performance of a new high-density Multiple Line Grid Array (MLGA) package Ahn, Seungyoung; Lee, Joon-Woo; Kim, Jonghoon; Ryu, Woongwhan; Kim, Young-Soo; Yoon, Chong K.; Kim, Joungho, 50th Electronic Components and Technology Conference, pp.497 - 501, Electronic Components and Technology Conference, 2000-05 |
| High-frequency Measurements of TSV failures Kim, Joohee; Cho, Jonghyun; Pak, Jun So; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08 |
| High-frequency modeling and signal integrity analysis of high-density silicone rubber socket Kim, Hyesoo; Park, Junyong; Park, Shinyoung; Kim, Jonghoon J; Kim, Joungho; Ha, Dongho; Bae, Michael; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.55 - 57, Institute of Electrical and Electronics Engineers Inc., 2016-12 |
| High-frequency on-chip inductance model Sim, SP; Lee, Kwyro; Yang, CY, IEEE ELECTRON DEVICE LETTERS, v.23, no.12, pp.740 - 742, 2002-12 |
| High-Frequency Performance of GaAs Floated Electron Channer FET(FECFET) Kwon, Young Se, International Conference on VLSI and CAD, 1993 |
| HIGH-FREQUENCY RESONANT AC/DC RECTIFIER WITH UNITY POWER-FACTOR CHOI, HC; HAN, JW; Youn, Myung Joong, ELECTRONICS LETTERS, v.28, no.17, pp.1592 - 1594, 1992-08 |
| High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Kim, Joo-Hee; Pak, Jun-So; Cho, Jong-Hyun; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Hee-Gon; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.181 - 195, 2011-02 |
| High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul; Lee, Junho; Park, Kunwoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.4, pp.697 - 707, 2014-04 |
| High-frequency scalable modeling of a through silicon via (TSV) and proposal of a failure detection method of 3D ICs = 3차원 집적회로에서 TSV의 고주파 모델링 및 TSV 불량 검출 방법에 관한 연구link Kim, Joo-Hee; 김주희; et al, 한국과학기술원, 2013 |
| HIGH-FREQUENCY SIGNAL PREDISTORTION DEVICE AND NONLINEAR DISTORTION CORRECTING DEVICE FOR POWER AMPLIFIER 이용훈; 이상일; 김민현; 설영욱; 정의림; 홍순일; 김성진; et al, 2018-03-20 |
Discover
Open Access
- 573 OA Article
Date issued
- 4,902 2020 - 2024
- 18,937 2010 - 2019
- 15,019 2000 - 2009
- 7,644 1990 - 1999
- 2,391 1980 - 1989