Browse "School of Electrical Engineering(전기및전자공학부)" by Title 

Showing results 20361 to 20380 of 51095

20361
High-fidelity and high-efficiency analog amplifier combined with digital amplifier

조규형, 2002-05-28

20362
High-fidelity and high-efficiency analog amplifier combined with digital amplifier

Cho, Gyu-Hyeong; Jung, Nam-Sung

20363
High-Fidelity Depth Upsampling Using the Self-Learning Framework

Shim, Inwook; Oh, Tae-Hyun; Kweon, In So, SENSORS, v.19, no.1, 2019-01

20364
High-fidelity energy-efficient audio power amplifier for mobile applications = 휴대 기기를 위한 고효율, 고충실도 오디오 파워 증폭기link

Lee, Ji-Hun; Je, Minkyu; 제민규; Cho, Gyu-Hyeong; et al, 한국과학기술원, 2021

20365
HIGH-FIELD BREAKDOWN IN THIN OXIDES GROWN IN N2O AMBIENT

JOSHI, AB; Yoon, Giwan; KIM, JH; LO, GQ; KWONG, DL, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.40, no.8, pp.1437 - 1445, 1993-08

20366
High-field electron transport and drift velocity saturation in 2D InSe

Seok, Yongwook; Jang, Hanbyeol; Im, Heungsoon; Lee, Kayoung, The 12th Recent Progress in Graphene and Two-dimensional Materials Research Conference (RPGR 2021), Korean Graphene Society, 2021-10-13

20367
High-Field Electron Transport and High Saturation Velocity in Multilayer Indium Selenide Transistors

Seok, Yongwook; Jang, Hanbyeol; Choi, Yitaek; Ko, Yeonghyeon; Kim, Minje; Im, Heungsoon; Watanabe, Kenji; et al, ACS NANO, v.18, no.11, pp.8099 - 8106, 2024-03

20368
High-field electron transport in InSe and its applications

이가영, 제 9회 한국그래핀 · 2차원 소재 심포지엄, 한국그래핀학회, 2022-07-12

20369
High-field magnetic resonance techniques for brain research

Kim, Dae-Shik; Garwood, M, CURRENT OPINION IN NEUROBIOLOGY, v.13, no.5, pp.612 - 619, 2003-10

20370
High-field saturation velocity in InSe nanosheet on hBN

Seok, YongWook; Jang, Hanbyeol; Im, Heungsoon; Lee, Kayoung, 2023 Advanced Epitaxy for Freestanding Membranes and 2D Materials, Massachusetts Institute of Technology, 2023-07-10

20371
HIGH-FIELD-INDUCED LEAKAGE IN ULTRATHIN N2O OXIDES

Yoon, Giwan; JOSHI, AB; KIM, J; KWONG, DL, IEEE ELECTRON DEVICE LETTERS, v.14, no.5, pp.231 - 233, 1993-05

20372
High-finesse AlxOy/AlGaAs nonabsorbing optical cavity

Shin, HE; Ju, YG; Song, HW; Song, DS; Han, IY; Ser, JH; Ryu, HY; et al, APPLIED PHYSICS LETTERS, v.72, no.18, pp.2205 - 2207, 1998-05

20373
High-frequency Displacement Monitoring Robot System Using Sensor Fusion of a Visually Servoed Paired Structured Light System with an Inertial Measurement Unit

Jeon, Haemin; Kim, Youngjae; Myung, Hyun, ICCES 2014 (Int'l Conf. on Computational & Experimental Engineering and Sciences), ICCES'14 Organizing Committee, 2014-06-13

20374
High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test

Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J.; Kim, DongHyun; Son, Kyungjune; Kim, Subin; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.12, pp.2152 - 2162, 2018-12

20375
High-frequency Electrical Model of Chip-to-Chip Via Interconnection for 3-D Chip Stacking Package

Kim, Joungho; Ryu, Chunghyun; Chung, Daehyun; Lee, Junho; Lee, Kwangyong; Oh, Taesung, IEEE 14th(13) Topical Meeting on Electrical Performance of Electronic Packaging, pp.151 - 154, IEEE, 2005-10

20376
High-frequency electrical performance of a new high-density Multiple Line Grid Array (MLGA) package

Ahn, Seungyoung; Lee, Joon-Woo; Kim, Jonghoon; Ryu, Woongwhan; Kim, Young-Soo; Yoon, Chong K.; Kim, Joungho, 50th Electronic Components and Technology Conference, pp.497 - 501, Electronic Components and Technology Conference, 2000-05

20377
High-frequency Measurements of TSV failures

Kim, Joohee; Cho, Jonghyun; Pak, Jun So; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

20378
High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package

Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08

20379
High-frequency modeling and signal integrity analysis of high-density silicone rubber socket

Kim, Hyesoo; Park, Junyong; Park, Shinyoung; Kim, Jonghoon J; Kim, Joungho; Ha, Dongho; Bae, Michael; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.55 - 57, Institute of Electrical and Electronics Engineers Inc., 2016-12

20380
High-frequency on-chip inductance model

Sim, SP; Lee, Kwyro; Yang, CY, IEEE ELECTRON DEVICE LETTERS, v.23, no.12, pp.740 - 742, 2002-12

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