DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, WK | ko |
dc.contributor.author | Kim, JH | ko |
dc.contributor.author | Jeong, SW | ko |
dc.contributor.author | Lee, HyuckMo | ko |
dc.date.accessioned | 2007-11-16T07:32:59Z | - |
dc.date.available | 2007-11-16T07:32:59Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2002-01 | - |
dc.identifier.citation | JOURNAL OF MATERIALS RESEARCH, v.17, no.1, pp.43 - 51 | - |
dc.identifier.issn | 0884-2914 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1973 | - |
dc.description.abstract | Interfacial phase and microstructure, solder hardness. and joint strength of Sn-3.5Ag-X (X = Cu. In, Ni; compositions are all in wt% unless specified otherwise) solder alloys were investigated. Considering the melting behavior and the mechanical properties, five compositions of Sn-3.5Ag-X solder alloys were selected. To examine the joint characteristics, they were soldered on under bump metallurgy isothermally at 250 degreesC for 60 s. Aging and thermal cycling (T/C) were also performed on the solder joint. The interfacial microstructure of the joint was observed by scanning electron microscopy. X-ray diffraction and energy dispersive x-ray analyses were made to identify the type of solder phase and to measure compositions. Excessive growth of an inter-facial intermetallic layer in the Sn-3.5Ag-6.5 In solder joint led to a brittle fracture. In the other four solder joints, ductile fractures occurred through the solder region and the solder hardness was closely related with the joint strength. | - |
dc.description.sponsorship | This study has been supported by the Center for Electronic Packaging Materials (CEPM) of the Korea Science and Engineering Foundation (KOSEF). | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | MATERIALS RESEARCH SOCIETY | - |
dc.subject | THERMODYNAMIC ASSESSMENT | - |
dc.subject | MECHANICAL-PROPERTIES | - |
dc.subject | SN SYSTEM | - |
dc.subject | LEAD-FREE | - |
dc.subject | ALLOYS | - |
dc.subject | BI | - |
dc.subject | SUBSTRATE | - |
dc.subject | EVOLUTION | - |
dc.subject | FATIGUE | - |
dc.subject | GROWTH | - |
dc.title | Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint | - |
dc.type | Article | - |
dc.identifier.wosid | 000173190800009 | - |
dc.identifier.scopusid | 2-s2.0-0036259086 | - |
dc.type.rims | ART | - |
dc.citation.volume | 17 | - |
dc.citation.issue | 1 | - |
dc.citation.beginningpage | 43 | - |
dc.citation.endingpage | 51 | - |
dc.citation.publicationname | JOURNAL OF MATERIALS RESEARCH | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Lee, HyuckMo | - |
dc.contributor.nonIdAuthor | Choi, WK | - |
dc.contributor.nonIdAuthor | Kim, JH | - |
dc.contributor.nonIdAuthor | Jeong, SW | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | THERMODYNAMIC ASSESSMENT | - |
dc.subject.keywordPlus | MECHANICAL-PROPERTIES | - |
dc.subject.keywordPlus | SN SYSTEM | - |
dc.subject.keywordPlus | LEAD-FREE | - |
dc.subject.keywordPlus | ALLOYS | - |
dc.subject.keywordPlus | BI | - |
dc.subject.keywordPlus | SUBSTRATE | - |
dc.subject.keywordPlus | EVOLUTION | - |
dc.subject.keywordPlus | FATIGUE | - |
dc.subject.keywordPlus | GROWTH | - |
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