Calculation of surface tension and wetting properties of Sn-based solder alloys
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yoon, SW | ko |
| dc.contributor.author | Choi, WK | ko |
| dc.contributor.author | Lee, HyuckMo | ko |
| dc.date.accessioned | 2007-11-16T07:04:43Z | - |
| dc.date.available | 2007-11-16T07:04:43Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1999-01 | - |
| dc.identifier.citation | SCRIPTA MATERIALIA, v.40, no.3, pp.297 - 302 | - |
| dc.identifier.issn | 1359-6462 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/1969 | - |
| dc.description.sponsorship | This study has been supported by the Minstry of Science and Technology (MOST) through the Center for Interface Science and Engineering of Materials (CISEM) | en |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
| dc.subject | BINARY-LIQUID ALLOYS | - |
| dc.subject | PHASE-DIAGRAM | - |
| dc.subject | SYSTEM | - |
| dc.subject | CU | - |
| dc.title | Calculation of surface tension and wetting properties of Sn-based solder alloys | - |
| dc.type | Article | - |
| dc.identifier.wosid | 000078767700006 | - |
| dc.identifier.scopusid | 2-s2.0-0033534249 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 40 | - |
| dc.citation.issue | 3 | - |
| dc.citation.beginningpage | 297 | - |
| dc.citation.endingpage | 302 | - |
| dc.citation.publicationname | SCRIPTA MATERIALIA | - |
| dc.identifier.doi | 10.1016/S1359-6462(98)00417-5 | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Lee, HyuckMo | - |
| dc.contributor.nonIdAuthor | Yoon, SW | - |
| dc.contributor.nonIdAuthor | Choi, WK | - |
| dc.type.journalArticle | Article | - |
| dc.subject.keywordPlus | BINARY-LIQUID ALLOYS | - |
| dc.subject.keywordPlus | PHASE-DIAGRAM | - |
| dc.subject.keywordPlus | SYSTEM | - |
| dc.subject.keywordPlus | CU | - |
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