학위논문(석사) - 한국과학기술원 : 전기및전자공학과, 2013.2, [ vi, 48 p. ]
Network-on-Chip; 매니코어; 결함-허용; TSV; 3D 집적회로; 네트워크-온-칩; 3D IC; Through-Silicon-Via; Fault-tolerance; Many-core
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