Application of Thermal Stress Device for Measuring Thermal Stresses

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Publisher
Int'l Association of Structural Eng. & Mechanics and Korea Advanced Inst. of Science & Technology (KAIST)
Issue Date
2014-08-26
Language
English
Citation

The 2014 World Congress on Advances in Civil, Environmental, and Materials Research (ACEM'14), pp.268 - 275

URI
http://hdl.handle.net/10203/193251
Appears in Collection
CE-Conference Papers(학술회의논문)
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