Application of Thermal Stress Device for Measuring Thermal Stresses

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dc.contributor.authorCha, Sang-Lyulko
dc.contributor.authorKim, Jin-Keunko
dc.date.accessioned2015-01-29T05:02:56Z-
dc.date.available2015-01-29T05:02:56Z-
dc.date.created2014-12-17-
dc.date.issued2014-08-26-
dc.identifier.citationThe 2014 World Congress on Advances in Civil, Environmental, and Materials Research (ACEM'14), pp.268 - 275-
dc.identifier.urihttp://hdl.handle.net/10203/193251-
dc.languageEnglish-
dc.publisherInt'l Association of Structural Eng. & Mechanics and Korea Advanced Inst. of Science & Technology (KAIST)-
dc.titleApplication of Thermal Stress Device for Measuring Thermal Stresses-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage268-
dc.citation.endingpage275-
dc.citation.publicationnameThe 2014 World Congress on Advances in Civil, Environmental, and Materials Research (ACEM'14)-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationBEXCO, Busan-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Jin-Keun-
dc.contributor.nonIdAuthorCha, Sang-Lyul-
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CE-Conference Papers(학술회의논문)
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