DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, J. H. | ko |
dc.contributor.author | Yu, Jin | ko |
dc.date.accessioned | 2014-12-16T01:36:40Z | - |
dc.date.available | 2014-12-16T01:36:40Z | - |
dc.date.created | 2014-11-04 | - |
dc.date.created | 2014-11-04 | - |
dc.date.created | 2014-11-04 | - |
dc.date.issued | 2014-11 | - |
dc.identifier.citation | JOURNAL OF ELECTRONIC MATERIALS, v.43, no.11, pp.4335 - 4343 | - |
dc.identifier.issn | 0361-5235 | - |
dc.identifier.uri | http://hdl.handle.net/10203/192922 | - |
dc.description.abstract | The occurrence of black pad in the electroless Ni film during the immersion gold process is related to the surface morphology of the Ni(P) film. A nonuniform distribution of the nodule size and curvature is the crucial factor. Large nodules with small surface curvatures had higher P concentration and did not corrode, while small nodules with large surface curvatures had lower P concentration and corroded. Experiments using different types of Cu substrates suggest that the Ni(P) film black pad susceptibility increased with the defect density and/or the residual stress in the underlying substrate. Annealing the Cu substrate before the electroless Ni plating greatly reduced the black pad formation. | - |
dc.language | English | - |
dc.publisher | SPRINGER | - |
dc.subject | NICKEL IMMERSION GOLD | - |
dc.subject | PCB FINAL FINISHES | - |
dc.title | Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM | - |
dc.type | Article | - |
dc.identifier.wosid | 000342494800058 | - |
dc.identifier.scopusid | 2-s2.0-85027941027 | - |
dc.type.rims | ART | - |
dc.citation.volume | 43 | - |
dc.citation.issue | 11 | - |
dc.citation.beginningpage | 4335 | - |
dc.citation.endingpage | 4343 | - |
dc.citation.publicationname | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.identifier.doi | 10.1007/s11664-014-3344-6 | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Kim, J. H. | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Black pad | - |
dc.subject.keywordAuthor | electroless Ni film | - |
dc.subject.keywordAuthor | corrosion | - |
dc.subject.keywordAuthor | growth mode of thin film | - |
dc.subject.keywordAuthor | Black pad | - |
dc.subject.keywordAuthor | electroless Ni film | - |
dc.subject.keywordAuthor | corrosion | - |
dc.subject.keywordAuthor | growth mode of thin film | - |
dc.subject.keywordPlus | NICKEL IMMERSION GOLD | - |
dc.subject.keywordPlus | PCB FINAL FINISHES | - |
dc.subject.keywordPlus | NICKEL IMMERSION GOLD | - |
dc.subject.keywordPlus | PCB FINAL FINISHES | - |
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