DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Il | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2014-12-09T06:06:19Z | - |
dc.date.available | 2014-12-09T06:06:19Z | - |
dc.date.created | 2014-09-15 | - |
dc.date.created | 2014-09-15 | - |
dc.date.issued | 2014-05 | - |
dc.identifier.citation | JOURNAL OF ELECTRONIC MATERIALS, v.43, no.9, pp.3236 - 3242 | - |
dc.identifier.issn | 0361-5235 | - |
dc.identifier.uri | http://hdl.handle.net/10203/192528 | - |
dc.description.abstract | Photo-active anisotropic conductive films (PA-ACFs) with curing temperatures below 120A degrees C were introduced using photo-active curing agents. The PA-ACFs showed no curing before UV activation, and the crosslinking systems of the PA-ACFs were not activated under fluorescent light exposure. However, after UV activation, the PA-ACFs were completely cured at 120A degrees C within 10 s. Flex-on-board (FOB) assembly using PA-ACFs had adhesion strength and joint resistances similar to those of the FOB assemblies using conventional epoxy-based ACFs. This study demonstrates that PA-ACFs provide reliable interconnection and minimal thermal deformation among all the commercially available ACFs, especially for low T (g) substrate applications. | - |
dc.language | English | - |
dc.publisher | SPRINGER | - |
dc.subject | GENERATORS | - |
dc.title | Low-Temperature Curable Photo-Active Anisotropic Conductive Films (PA-ACFs) | - |
dc.type | Article | - |
dc.identifier.wosid | 000340363600025 | - |
dc.identifier.scopusid | 2-s2.0-84906319161 | - |
dc.type.rims | ART | - |
dc.citation.volume | 43 | - |
dc.citation.issue | 9 | - |
dc.citation.beginningpage | 3236 | - |
dc.citation.endingpage | 3242 | - |
dc.citation.publicationname | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.identifier.doi | 10.1007/s11664-014-3209-z | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Anisotropic conductive film (ACF) | - |
dc.subject.keywordAuthor | low-temperature curing | - |
dc.subject.keywordAuthor | photo-active | - |
dc.subject.keywordAuthor | thermal deformation | - |
dc.subject.keywordAuthor | reliability | - |
dc.subject.keywordPlus | GENERATORS | - |
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