The FPGA (field programmable gate array) manufactured by using the CCGA484 (ceramic column grid array 484) package has been increasingly growing in demand day by day. However, the CCGA484 package has not been evaluated in space programs yet. In addition, the CCGA484 package is soldered on a PCB (printed circuit board) by the combination of Pb and Sn in ratios from 37% to 67%. If the thermal characteristics of the device for use in space program is to be improved and the numbers of input ports, output ports and internal gates are to increased, the pin quantity and other characteristics of the CCGA484 package must be ensured. During the qualification test for the application of the CCGA484 package in space programs, the changes in properties of the materials in the soldered parts and the changes in the electrical and the physical characteristic were investigated and yielded results that the dose increased from 0 krad to 100 krad. The difference between the electric potential before the radiation and after the accumulation of radiation was less than 0.01%.