High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

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dc.contributor.authorRyu, Woonghwanko
dc.contributor.authorYim, Myung-Jinko
dc.contributor.authorAhn, Seungyoungko
dc.contributor.authorLee, Junhoko
dc.contributor.authorKim, Woopoungko
dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2010-05-19T08:09:41Z-
dc.date.available2010-05-19T08:09:41Z-
dc.date.created2012-02-06-
dc.date.issued2000-09-
dc.identifier.citationIEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545-
dc.identifier.issn1521-3331-
dc.identifier.urihttp://hdl.handle.net/10203/18484-
dc.description.abstractThis paper firstly reports on the high-frequency SPICE model of the ACF flip-chip interconnections up to 13 GHz. The extraction process Is based on an optimization procedure, called a genetic algorithm, which is known as a robust optimization tool. The proposed equivalent circuit model of the ACF interconnection can readily be used in SPICE circuit simulations for signal integrity analysis of high-frequency packages. Two different ACF interconnections were studied using the Au-coated polymer ball and Ni-filled ball. The extracted models of the two ACFs were found strongly dependent on not only size and rigidity of the conducting balls, but also on their magnetic permeability.-
dc.description.sponsorshipIEEE Components, Packaging, and Manufacturing Technology Societyen
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleHigh-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm-
dc.typeArticle-
dc.identifier.wosid000089418400018-
dc.identifier.scopusid2-s2.0-0034273631-
dc.type.rimsART-
dc.citation.volume23-
dc.citation.issue3-
dc.citation.beginningpage542-
dc.citation.endingpage545-
dc.citation.publicationnameIEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorAhn, Seungyoung-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorRyu, Woonghwan-
dc.contributor.nonIdAuthorYim, Myung-Jin-
dc.contributor.nonIdAuthorLee, Junho-
dc.contributor.nonIdAuthorKim, Woopoung-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorACF flip-chip interconnection-
dc.subject.keywordAuthorgenetic algorithm-
dc.subject.keywordAuthormicrowave model-
dc.subject.keywordAuthorresonance-
dc.subject.keywordAuthorSPICE model-
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