3-D Packaging 용 Through-Si Via/Trench의 충진에 관한 연구Filling of through-Si Via/Trench for 3-D packaging
- Advisors
- 이원종researcher; Lee, Won-Jong
- Description
- 한국과학기술원 : 신소재공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2012
- Identifier
- 487122/325007 / 020097021
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 신소재공학과, 2012.2, [ viii, 88 p. ]
- Keywords
관통전극; 전해도금법; 화학기상증착법; 전산모사; Filling of TSV/T; Cu electroplating; Cu CECVD; simulation; 충진
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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