3-D Packaging 용 Through-Si Via/Trench의 충진에 관한 연구Filling of through-Si Via/Trench for 3-D packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 이원종 | - |
| dc.contributor.advisor | Lee, Won-Jong | - |
| dc.contributor.author | 김창규 | - |
| dc.contributor.author | Kim, Chang-Gyu | - |
| dc.date.accessioned | 2013-09-12T04:41:59Z | - |
| dc.date.available | 2013-09-12T04:41:59Z | - |
| dc.date.issued | 2012 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=487122&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/181938 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 신소재공학과, 2012.2, [ viii, 88 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 관통전극 | - |
| dc.subject | 전해도금법 | - |
| dc.subject | 화학기상증착법 | - |
| dc.subject | 전산모사 | - |
| dc.subject | Filling of TSV/T | - |
| dc.subject | Cu electroplating | - |
| dc.subject | Cu CECVD | - |
| dc.subject | simulation | - |
| dc.subject | 충진 | - |
| dc.title | 3-D Packaging 용 Through-Si Via/Trench의 충진에 관한 연구 | - |
| dc.title.alternative | Filling of through-Si Via/Trench for 3-D packaging | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 487122/325007 | - |
| dc.description.department | 한국과학기술원 : 신소재공학과, | - |
| dc.identifier.uid | 020097021 | - |
| dc.contributor.localauthor | 이원종 | - |
| dc.contributor.localauthor | Lee, Won-Jong | - |
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- MS-Theses_Ph.D.(박사논문)
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