Thermocompression ultrasonic bonding technology for mounting IT components with high-density pin counts고밀도 핀 배열의 IT 부품 실장을 위한 열압착 초음파 본딩 기술
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | Kim, Kyung-Soo | - |
| dc.contributor.advisor | 김경수 | - |
| dc.contributor.author | Jang, Tae-Young | - |
| dc.contributor.author | 장태영 | - |
| dc.date.accessioned | 2013-09-12T02:38:30Z | - |
| dc.date.available | 2013-09-12T02:38:30Z | - |
| dc.date.issued | 2009 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=487968&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/181810 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 기계공학전공, 2009.2, [ x, 86 p. ] | - |
| dc.language | eng | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | LCD driver IC | - |
| dc.subject | Anisotropic conductive film | - |
| dc.subject | Curing rate | - |
| dc.subject | Thermocompression ultrasonic bonding | - |
| dc.subject | 비 등방성 전도성 필름 | - |
| dc.subject | LCD 드라이브 IC | - |
| dc.subject | 경화도 | - |
| dc.subject | 열압착 초음파 본딩 | - |
| dc.subject | 최대 허용 진폭 | - |
| dc.subject | maximum allowable amplitude | - |
| dc.title | Thermocompression ultrasonic bonding technology for mounting IT components with high-density pin counts | - |
| dc.title.alternative | 고밀도 핀 배열의 IT 부품 실장을 위한 열압착 초음파 본딩 기술 | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 487968/325007 | - |
| dc.description.department | 한국과학기술원 : 기계공학전공, | - |
| dc.identifier.uid | 020073488 | - |
| dc.contributor.localauthor | Kim, Kyung-Soo | - |
| dc.contributor.localauthor | 김경수 | - |
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- ME-Theses_Master(석사논문)
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