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ENIG 표면처리 시 발생되는 Black Pad 현상의 발생기구 및 UBM의 영향에 관한 연구 = A study on the mechanisms of black pad formation and the effects of UBM on black pad after ENIG processlink 김지희; Kim, Ji-Hee; et al, 한국과학기술원, 2011 |
Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
(UBM)Under bump metallurgy study for Pb-free bumping Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05 |
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