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Showing results 1 to 6 of 6

1
An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

Seo, Sun-Kyoung; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.2, pp.257 - 265, 2009-02

2
Diffusional solidification behavior in 304 stainless steel

Lee, HyuckMo; Bae, JS; Soh, JR; Kim, SK; Lee, YD, MATERIALS TRANSACTIONS JIM, v.39, no.6, pp.633 - 639, 1998-06

3
Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging

Jeong, SW; Kim, JH; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1530 - 1544, 2004-12

4
Nitrogen porosity in nitrogen bearing austenitic stainless steel

Yang, SH; Lee, Zin-Hyoung, MATERIALS SCIENCE FORUM, v.475-479, pp.2679 - 2682, 2005

5
냉각 속도가 알루미늄 합금의 응고시 편석에 미치는 영향에 관한 실험적 및 수치해석적 연구 = Effect of cooling rate on the solidification segregation of aluminum alloyslink

최정윤; Choi, Jeong-Yun; et al, 한국과학기술원, 2001

6
스테인리스강의 응고 시 질소 기포 형성에 관한 연구 = A study on the formation of nitrogen gas pore during solidification of stainless steelslink

양성호; Yang, Seong-Ho; et al, 한국과학기술원, 2003

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