An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

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The microstructure and microhardness of Sn-xAg and Sn-xCu solders were investigated as functions of alloy composition and cooling rate. The Ag compositions examined varied from 0.5 wt.% to 3.5 wt.%, while Cu varied from 0.5 wt.% to 2.0 wt.%. Three cooling rates were employed during solidification: 0.02A degrees C/s (furnace cooling), about 10A degrees C/s (air cooling), and 100A degrees C/s or higher (rapid solidification). Sn grain size and orientation were observed by cross-polarization light microscopy and electron-backscattering diffraction (EBSD) techniques. The microhardness was measured to correlate the mechanical properties with alloy compositions and cooling rates. From this study, it was found that both alloy composition and cooling rate can significantly affect the Sn grain size and hardness in Sn-rich solders. The critical factors that affect the microstructure-property relationships of Sn-rich solders are discussed, including grain size, crystal orientation, dendrite cells, twin boundaries, and intermetallic compounds (IMC).
Publisher
SPRINGER
Issue Date
2009-02
Language
English
Article Type
Article; Proceedings Paper
Keywords

GROWTH; SYSTEM; TIN

Citation

JOURNAL OF ELECTRONIC MATERIALS, v.38, no.2, pp.257 - 265

ISSN
0361-5235
URI
http://hdl.handle.net/10203/174249
Appears in Collection
MS-Journal Papers(저널논문)
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