Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject Composite materials
Showing results 1 to 10 of 10
| Effect of carbon mixing on the degree of perpendicular texture of FePt:C nanocomposite film for magnetic recording media Lee, S. H.; Park, Joong Keun, MATERIALS CHEMISTRY AND PHYSICS, v.118, no.1, pp.213 - 218, 2009-11 |
| Effects of Curing Agent and Curing Temperature on Material Properties of Epoxy/BaTiO3 Composite Embedded Capacitor Films Lee, Hyeong Gi; Paik, Kyung-Wook, IEEE Transactions on Components Packaging and Manufacturing Technology, v.5, no.4, pp.451 - 459, 2015-04 |
| Electrical conductivity studies on the LSGM-CGO composite electrolytes Jo, Seung Hwan; Pandurangan, Muralidharan; Kim, Do Kyung, JOURNAL OF ALLOYS AND COMPOUNDS, v.491, no.1-2, pp.416 - 419, 2010-02 |
| Elevated temperature ablation resistance of HfC particle-reinforced tungsten composites Lee, Dongju; Umer, Malik Adeel; Ryu, Ho Jin; Hong, Soon-Hyung, INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, v.43, pp.89 - 93, 2014-03 |
| Energy storage in composites of a redox couple host and a lithium ion host Kim, Sung-Wook; Nam, Kyung-Wan; Seo, Dong-Hwa; Hong, Ji-Hyun; Kim, Hyung-Sub; Gwon, Hyeok-Jo; Kang, Ki-Suk, NANO TODAY, v.7, no.3, pp.168 - 173, 2012-06 |
| Fabrication of porous ceramics by an ice-templating method and its applications = 동결 주조법을 이용한 다공성 세라믹 구조체 제조 및 응용방안 연구link Kim Dong Seok; 김동석; et al, 한국과학기술원, 2015 |
| Rollable Transparent Glass-Fabric Reinforced Composite Substrate for Flexible Devices Jin, Jung-Ho; Ko, Ji-Hoon; Yang, Seung-Cheol; Bae, Byeong-Soo, ADVANCED MATERIALS, v.22, no.40, pp.4510 - 4515, 2010-10 |
| SiC 분말 강화 폴리에틸렌 기지 고분자 복합재료의 음향감쇄 특성 및 기구 = Acoutic attenuation behavior and mechanism of SiC particle reinforced polyethylene matrix composite materialslink 김경섭; Kim, Kyong-Sub; et al, 한국과학기술원, 1999 |
| The effect of HfC content on mechanical properties HfC-W composites Lee, Dong Ju; Umer, Malik Adeel; Ryu, Ho Jin; Hong, Soon-Hyung, INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, v.44, pp.49 - 53, 2014-05 |
| Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection Lee, Hyeong Gi; Choi, Yong-Won; Shin, Ji Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.11, pp.1567 - 1572, 2015-11 |
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